PIC24HJ16GP304-I/ML Microchip Technology, PIC24HJ16GP304-I/ML Datasheet - Page 17

• Manufacturer Part Number: PIC24HJ16GP304-I/ML
• Description: IC PIC MCU FLASH 16K 44QFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ16GP304-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 16KB (5.5K x 24)
• Package / Case: 44-QFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 13x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 13-ch x 12-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP)™ and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
microcontroller as short as possible. If the ICSP con-
nector is expected to experience an ESD event, a
series resistor is recommended, with the value in the
range of a few tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
in-circuit emulator
For more information on MPLAB ICD 2, MPLAB ICD 3,
or MPLAB REAL ICE in-circuit emulator connection
requirements, refer to the following documents that are
available on the Microchip website.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
© 2011 Microchip Technology Inc.
IH
Guide” DS51331
Guide” DS51616
(poster) DS51749
) and input low (V
®
ICSP Pins
ICD 2, MPLAB ICD 3, or MPLAB REAL ICE™
®
®
®
®
PIC24HJ32GP202/204 AND PIC24HJ16GP304
ICD 2 In-Circuit Debugger User’s
ICD 2 Design Advisory” DS51566
ICD 3 Design Advisory” DS51764
REAL ICE™ In-Circuit Emulator User’s
®
®
®
ICD 2” (poster) DS51265
ICD 3” (poster) DS51765
REAL ICE™ In-Circuit Emulator”
IL
) requirements.
2.6
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
Section 8.0 “Oscillator Configuration”
The oscillator circuit should be placed on the same
side of the board as the microcontroller. Also, place
the oscillator circuit close to the respective oscillator
pins, not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in
FIGURE 2-3:
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
External Oscillator Pins
secondary
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Figure
oscillator
DS70289G-page 17
2-3.
for details).
(refer
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to