PIC24HJ16GP304-I/ML Microchip Technology, PIC24HJ16GP304-I/ML Datasheet - Page 264

• Manufacturer Part Number: PIC24HJ16GP304-I/ML
• Description: IC PIC MCU FLASH 16K 44QFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ16GP304-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 16KB (5.5K x 24)
• Package / Case: 44-QFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 13x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 13-ch x 12-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24HJ32GP202/204 AND PIC24HJ16GP304
TABLE A-2:
DS70289G-page 264
Section 22.0 “Electrical Characteristics”
Section 23.0 “High Temperature Electrical
Characteristics”
Section 24.0 “Packaging Information”
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Added 28-pin SSOP Thermal Packaging Characteristics (see
Table
Removed Note 4 from the DC Temperature and Voltage
Specifications (see
Updated the maximum value for parameter DI19 and added
parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input
Specifications (see
Updated Note 3 in the PLL Clock Timing Specifications (see
Table
Removed Note 2 from the AC Characteristics: Internal RC Accuracy
(see
Updated the characteristic description for parameter DI35 in the I/O
Timing Requirements (see
Updated all SPI specifications (see
and
Added Note 4 to the 12-bit ADC Module Specifications (see
Table
Added Note 4 to the 10-bit ADC Module Specifications (see
Table
Updated all ambient temperature end range values to +150ºC
throughout the chapter.
Updated the storage temperature end range to +160ºC.
Updated the maximum junction temperature from +145ºC to +155ºC.
Updated Note 1 in the PLL Clock Timing Specifications (see
Table
Added Note 3 to the 12-bit Mode ADC Module Specifications (see
Table
Added Note 3 to the 10-bit Mode ADC Module Specifications (see
Table
Added the 28-Lead SSOP package information (see
“Package Marking Information”
Details”).
Added the “SS” definition for the SSOP package.
Figure 22-10
Table
22-3).
22-17).
22-39).
22-40).
23-10).
23-17).
23-18).
22-18).
through
Table
Table
Update Description
22-4).
22-9).
Figure
Table
22-20).
22-16).
and
Table 22-28
© 2011 Microchip Technology Inc.
Section 24.2 “Package
through
Section 24.1
Table 22-35