DSPIC33FJ32MC202-I/MM Microchip Technology, DSPIC33FJ32MC202-I/MM Datasheet - Page 17
![IC DSPIC MCU/DSP 32K 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
DSPIC33FJ32MC202-I/MM
Manufacturer Part Number
DSPIC33FJ32MC202-I/MM
Description
IC DSPIC MCU/DSP 32K 28QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(320 pages)
2.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
3.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
4.DSPIC33FJ32MC302-ISO.pdf
(436 pages)
5.DSPIC33FJ32MC204-IPT.pdf
(304 pages)
Specifications of DSPIC33FJ32MC202-I/MM
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-QFN
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
I2C, JTAG, SPI, UART
No. Of I/o's
21
Flash Memory Size
32KB
Supply Voltage Range
3V To 3.6V
Package
28QFN-S EP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
21
Interface Type
I2C/SPI/UART
On-chip Adc
6-chx10-bit|6-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ32MC202-I/MM
Manufacturer:
Microchip
Quantity:
1 485
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Manufacturer:
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- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC202-IMM PDF datasheet #2
- DSPIC33FJ32MC202-IMM PDF datasheet #3
- DSPIC33FJ32MC302-ISO PDF datasheet #4
- DSPIC33FJ32MC204-IPT PDF datasheet #5
- Current page: 17 of 304
- Download datasheet (3Mb)
2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming (ICSP) and debugging purposes.
It is recommended to keep the trace length between
the ICSP connector and the ICSP pins on the device as
short as possible. If the ICSP connector is expected to
experience an ESD event, a series resistor is
recommended, with the value in the range of a few tens
of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
in-circuit emulator.
For more information on MPLAB ICD 2, MPLAB ICD 3
or MPLAB REAL ICE™ in-circuit emulator connection
requirements, refer to the following documents that are
available on the Microchip website.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
2009 Microchip Technology Inc.
IH
Guide” DS51331
Guide” DS51616
(poster) DS51749
) and input low (V
®
ICSP Pins
ICD 2, MPLAB ICD 3 or MPLAB REAL ICE™
®
®
®
®
ICD 2 In-Circuit Debugger User’s
ICD 2 Design Advisory” DS51566
ICD 3 Design Advisory” DS51764
REAL ICE™ In-Circuit Emulator User’s
dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
®
®
®
REAL ICE™ In-Circuit Emulator”
ICD 2” (poster) DS51265
ICD 3” (poster) DS51765
IL
) requirements.
Preliminary
2.6
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
FIGURE 2-3:
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
External Oscillator Pins
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
DS70283G-page 17
13
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