DSPIC33FJ32MC202-I/MM Microchip Technology, DSPIC33FJ32MC202-I/MM Datasheet - Page 280
![IC DSPIC MCU/DSP 32K 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
DSPIC33FJ32MC202-I/MM
Manufacturer Part Number
DSPIC33FJ32MC202-I/MM
Description
IC DSPIC MCU/DSP 32K 28QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(320 pages)
2.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
3.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
4.DSPIC33FJ32MC302-ISO.pdf
(436 pages)
5.DSPIC33FJ32MC204-IPT.pdf
(304 pages)
Specifications of DSPIC33FJ32MC202-I/MM
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-QFN
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
I2C, JTAG, SPI, UART
No. Of I/o's
21
Flash Memory Size
32KB
Supply Voltage Range
3V To 3.6V
Package
28QFN-S EP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
21
Interface Type
I2C/SPI/UART
On-chip Adc
6-chx10-bit|6-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ32MC202-I/MM
Manufacturer:
Microchip
Quantity:
1 485
Part Number:
DSPIC33FJ32MC202-I/MM
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC202-IMM PDF datasheet #2
- DSPIC33FJ32MC202-IMM PDF datasheet #3
- DSPIC33FJ32MC302-ISO PDF datasheet #4
- DSPIC33FJ32MC204-IPT PDF datasheet #5
- Current page: 280 of 304
- Download datasheet (3Mb)
dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
26.2
DS70283G-page 280
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
D
A
E
e
L
c
b
e
1.345
MIN
.120
.015
.290
.240
.110
.008
.040
.014
A2
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
2009 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c
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