DSPIC33FJ64GP802-I/SP Microchip Technology, DSPIC33FJ64GP802-I/SP Datasheet - Page 398
![IC DSPIC MCU/DSP 64K 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
DSPIC33FJ64GP802-I/SP
Manufacturer Part Number
DSPIC33FJ64GP802-I/SP
Description
IC DSPIC MCU/DSP 64K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32GP204-IPT.pdf
(14 pages)
2.DSPIC33FJ32GP302-ISO.pdf
(412 pages)
3.DSPIC33FJ64GP804-IML.pdf
(402 pages)
Specifications of DSPIC33FJ64GP802-I/SP
Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
21
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b, D/A 4x16b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
16 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164338 - MOD SKT PIC24F/DSPIC33F 28SOICDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ64GP802-I/SP
Manufacturer:
NIPPON
Quantity:
43 000
- DSPIC33FJ32GP204-IPT PDF datasheet
- DSPIC33FJ32GP302-ISO PDF datasheet #2
- DSPIC33FJ64GP804-IML PDF datasheet #3
- Current page: 398 of 412
- Download datasheet (6Mb)
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
TABLE A-2:
DS70292E-page 398
Section 30.0 “Electrical
Characteristics”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Updated Typical values for Thermal Packaging Characteristics (see
Table 30-3).
Updated Min and Max values for parameter DC12 (RAM Data Retention
Voltage) and added Note 4 (see Table 30-4).
Updated Power-Down Current Max values for parameters DC60b and
DC60c (see Table 30-7).
Updated Characteristics for I/O Pin Input Specifications and added
parameter DI21 (see Table 30-9).
Updated Program Memory values for parameters 136, 137, and 138
(renamed to 136a, 137a, and 138a), added parameters 136b, 137b, and
138b, and added Note 2 (see Table 30-12).
Added parameter OS42 (G
(see Table 30-16).
Updated Watchdog Timer Time-out Period parameter SY20 (see
Table 30-21).
Updated the I
Updated parameters AD30a, AD31a, AD32a, AD33a, and AD34a (see
Table 30-38)
Updated parameters AD30b, AD31b, AD32b, AD33b, and AD34b (see
Table 30-39)
REF
Current Drain parameter AD08 (see Table 30-37).
M
Update Description
) to the External Clock Timing Requirements
© 2011 Microchip Technology Inc.
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