DSPIC33FJ128GP306A-I/PT Microchip Technology, DSPIC33FJ128GP306A-I/PT Datasheet - Page 321

• Manufacturer Part Number: DSPIC33FJ128GP306A-I/PT
• Description: IC DSPIC MCU/DSP 128K 64-TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP306A-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Data Ram Size: 16 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Core Frequency: 40MHz
• Core Supply Voltage: 3.3V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 53
• Flash Memory Size: 128KB
• Supply Voltage Range: 3V To 3.6V
• Rohs Compliant: No
• Package: 64TQFP
• Device Core: dsPIC
• Family Name: dSPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Interface Type: I2C/SPI/UART
• On-chip Adc: 18-chx10-bit|18-chx12-bit
• Number Of Timers: 9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1001 - DSPIC33 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TABLE 26-5:
TABLE 26-6:
TABLE 26-7:
© 2011 Microchip Technology Inc.
DC CHARACTERISTICS
HDC72a
HDC72f
HDC72g
Note 1:
DC CHARACTERISTICS
HDO10
HDO16
HDO20
HDO26
DC CHARACTERISTICS
HD130 E
HD134 T
Note 1:
Parameter
Param
Param
No.
No.
No.
2:
Symbol
V
V
RETD
P
Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.
These parameters are assured by design, but are not characterized or tested in manufacturing.
Programming of the Flash memory is not allowed above 125°C.
Symbol
OL
OH
Typical
DC CHARACTERISTICS: DOZE CURRENT (I
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS: PROGRAM MEMORY
Program Flash Memory
Cell Endurance
Characteristic Retention
39
18
18
Output Low Voltage
I/O ports
OSC2/CLKO
Output High Voltage
I/O ports
OSC2/CLKO
Characteristic
(1)
dsPIC33FJXXXGPX06A/X08A/X10A
Characteristic
Max
45
25
25
(1)
10,000
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
20
2.40
2.41
Min
Doze
Ratio
1:128
1:64
—
—
1:2
Typ
—
—
Typ
Units
—
—
—
—
mA
mA
mA
Max
—
—
Max
DOZE
0.4
0.4
—
—
+150°C
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
Units
)
Year
E/W
Units
V
V
V
V
A
A
-40° C to +150° C
1000 E/W cycles or less and no
other specifications are violated
A
≤ +150°C for High Temperature
≤ +150°C for High Temperature
≤ +150°C for High Temperature
I
I
I
I
OL
OL
OH
OH
3.3V
Conditions
= 1 mA, V
= 1 mA, V
= -1 mA, V
= -1 mA, V
Conditions
Conditions
DS70593C-page 321
DD
DD
DD
DD
(2)
20 MIPS
= 3.3V
= 3.3V
= 3.3V
= 3.3V