DSPIC33FJ128GP306A-I/PT Microchip Technology, DSPIC33FJ128GP306A-I/PT Datasheet - Page 331
![IC DSPIC MCU/DSP 128K 64-TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
DSPIC33FJ128GP306A-I/PT
Manufacturer Part Number
DSPIC33FJ128GP306A-I/PT
Description
IC DSPIC MCU/DSP 128K 64-TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Specifications of DSPIC33FJ128GP306A-I/PT
Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
64-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
53
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Data Ram Size
16 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Core Frequency
40MHz
Core Supply Voltage
3.3V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
53
Flash Memory Size
128KB
Supply Voltage Range
3V To 3.6V
Rohs Compliant
No
Package
64TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
I2C/SPI/UART
On-chip Adc
18-chx10-bit|18-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ128GP306A-I/PT
Manufacturer:
RENESAS
Quantity:
450
Company:
Part Number:
DSPIC33FJ128GP306A-I/PT
Manufacturer:
MICROCHIP
Quantity:
3 100
Company:
Part Number:
DSPIC33FJ128GP306A-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- Current page: 331 of 350
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© 2011 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
dsPIC33FJXXXGPX06A/X08A/X10A
1 2 3
D
D1
L
Dimension Limits
E1
NOTE 2
φ
Units
A2
A1
L1
E1
D1
N
A
E
D
e
L
φ
b
α
β
c
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
DS70593C-page 331
α
A2
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