DSPIC33FJ128GP706-I/PT Microchip Technology, DSPIC33FJ128GP706-I/PT Datasheet - Page 335

• Manufacturer Part Number: DSPIC33FJ128GP706-I/PT
• Description: IC DSPIC MCU/DSP 128K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP706-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Data Ram Size: 16 KB
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Data Rom Size: 4096 B
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33F
FIGURE 26-16:
TABLE 26-33: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
DS70165D-page 332
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
Note 1:
Param
No.
Note: Refer to Figure 26-1 for load conditions.
2:
3:
SCK
(CKP = 0)
(CKP = 1)
SDO
SS
SCK
SDI
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV
,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ SSx
X
X
Symbol
X
X
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Assumes 50 pF load on all SPIx pins.
X
SCKx Input Low Time
SCKx Input High Time
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SSx
High-Impedance
SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SP50
to SCKx
to SDOx Output
Characteristic
SP35
SP71
SP40
(3)
MSb In
or SCKx Input
MSb
SP41
SP70
(3)
(3)
(1)
SP30,SP31
Preliminary
(3)
(3)
Bit 14 - - - -1
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Bit 14 - - - - - -1
Min
120
30
30
20
20
10
—
—
—
—
—
SP73
SP72
Typ
10
10
—
—
—
—
—
—
—
—
—
(2)
SP72
SP73
LSb
LSb In
Max
25
25
30
50
—
—
—
—
—
—
—
SP52
-40°C T
© 2006 Microchip Technology Inc.
Units
SP51
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
+85°C
See parameter D032
See parameter D031
Conditions
—
—
—
—
—
—
—
—
—