DSPIC33FJ128GP706-I/PT Microchip Technology, DSPIC33FJ128GP706-I/PT Datasheet - Page 356

• Manufacturer Part Number: DSPIC33FJ128GP706-I/PT
• Description: IC DSPIC MCU/DSP 128K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP706-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Data Ram Size: 16 KB
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Data Rom Size: 4096 B
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

80-Lead Plastic Thin-Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-092
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
c
B
See ASME Y14.5M
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
L
F
E
D
B
A
c
n
MIN
.039
.037
.002
.018
.004
.007
.025
Preliminary
2
1
D1
0°
5°
5°
CH x 45°
.039 REF.
L
.020 BSC
.551 BSC
.551 BSC
.472 BSC
.472 BSC
INCHES
D
NOM
.043
.004
.024
.006
.035
A1
.039
.009
3.5°
10°
10°
80
20
A
MAX
.047
.006
.030
.008
.045
.041
.011
15°
15°
F
7°
MIN
1.00
0.95
0.05
0.45
0.09
0.17
0.64
0°
5°
5°
MILLIMETERS*
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
1.00 REF.
0.50 BSC
NOM
1.10
1.00
0.10
0.60
0.15
0.22
0.89
dsPIC33F
3.5°
Revised 07-22-05
10°
10°
80
20
A2
DS70165D-page 353
MAX
1.14
1.20
1.05
0.15
0.75
0.20
0.27
15°
15°
7°