PIC16F877-20/L Microchip Technology, PIC16F877-20/L Datasheet - Page 194

IC MCU FLASH 8KX14 EE 44PLCC

PIC16F877-20/L

Manufacturer Part Number
PIC16F877-20/L
Description
IC MCU FLASH 8KX14 EE 44PLCC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F877-20/L

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
44-PLCC
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/PSP/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
8-ch x 10-bit
Data Rom Size
256 B
Height
3.87 mm
Length
16.59 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
16.59 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164309 - MODULE SKT FOR PM3 44PLCC444-1001 - DEMO BOARD FOR PICMICRO MCUDVA16XL441 - ADAPTER DEVICE ICE 44PLCC309-1040 - ADAPTER 44-PLCC ZIF TO 40-DIP309-1039 - ADAPTER 44-PLCC TO 40-DIPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F877-20/L
Manufacturer:
MICROCHI
Quantity:
27
Part Number:
PIC16F877-20/L
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F877-20/L
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F87X
28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
DS30292C-page 192
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
Units
A2
A1
E1
D
n
p
A
E
h
L
B
c
2
1
D
L
MIN
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
28
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
NOM
2001 Microchip Technology Inc.
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
28
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8

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