PIC18F6621-I/PT Microchip Technology, PIC18F6621-I/PT Datasheet - Page 32

IC PIC MCU FLASH 32KX16 64TQFP

PIC18F6621-I/PT

Manufacturer Part Number
PIC18F6621-I/PT
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F6621-I/PT

Core Size
8-Bit
Program Memory Size
64KB (32K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC18
No. Of I/o's
53
Eeprom Memory Size
1024Byte
Ram Memory Size
3.75KB
Cpu Speed
40MHz
No. Of Timers
5
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3840 B
Interface Type
MSSP, SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F6621-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F6621-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
PIC18F6621-I/PT
Quantity:
2 850
PIC18F6X2X/8X2X
5.4
To allow portability of code, a PIC18F6X2X/8X2X pro-
grammer is required to read the configuration word
locations from the HEX file. If configuration word infor-
mation is not present in the HEX file, then a simple
warning message should be issued. Similarly, while
saving a HEX file, all configuration word information
must be included. An option to not include the configu-
ration word information may be provided. When
embedding configuration word information in the HEX
file, it should start at address 300000h.
Microchip Technology Inc. feels strongly that this
feature is important for the benefit of the end customer.
5.5
To allow portability of code, a PIC18F6X2X/8X2X pro-
grammer is required to read the data EEPROM infor-
mation from the HEX file. If data EEPROM information
is not present, a simple warning message should be
issued. Similarly, when saving a HEX file, all data
EEPROM information must be included. An option to
not include the data EEPROM information may be pro-
vided. When embedding data EEPROM information in
the HEX file, it should start at address F00000h.
Microchip Technology Inc. believes that this feature is
important for the benefit of the end customer.
DS30499B-page 32
Embedding Configuration Word
Information in the HEX File
Embedding Data EEPROM
Information In the HEX File
5.6
The checksum is calculated by summing the following:
• The contents of all code memory locations
• The configuration word, appropriately masked
• ID locations
The Least Significant 16 bits of this sum are the
checksum.
Table 5-4 (pages 33 through 34) describes how to
calculate the checksum for each device.
Note:
Checksum Computation
The checksum calculation differs depend-
ing on the code protect setting. Since the
code memory locations read out differently
depending on the code protect setting, the
table describes how to manipulate the
actual code memory values to simulate
the values that would be read from a pro-
tected device. When calculating a check-
sum by reading a device, the entire code
memory can simply be read and summed.
The configuration word and ID locations
can always be read.
 2003 Microchip Technology Inc.

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