PIC18F8620-I/PT Microchip Technology, PIC18F8620-I/PT Datasheet - Page 254

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PIC18F8620-I/PT

Manufacturer Part Number
PIC18F8620-I/PT
Description
IC MCU FLASH 32KX16 EE 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F8620-I/PT

Core Size
8-Bit
Program Memory Size
64KB (32K x 16)
Core Processor
PIC
Speed
25MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TFQFP
Controller Family/series
PIC18
No. Of I/o's
68
Eeprom Memory Size
1024Byte
Ram Memory Size
3.75KB
Cpu Speed
25MHz
No. Of Timers
5
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3840 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
68
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183022, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F8620-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F8620-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F6520/8520/6620/8620/6720/8720
23.3
Power-down mode is entered by executing a SLEEP
instruction.
If enabled, the Watchdog Timer will be cleared, but
keeps running, the PD bit (RCON<3>) is cleared, the
TO (RCON<4>) bit is set and the oscillator driver is
turned off. The I/O ports maintain the status they had
before the SLEEP instruction was executed (driving
high, low or high-impedance).
For lowest current consumption in this mode, place all
I/O pins at either V
cuitry is drawing current from the I/O pin, power-down
the A/D and disable external clocks. Pull all I/O pins
that are high-impedance inputs, high or low externally,
to avoid switching currents caused by floating inputs.
The T0CKI input should also be at V
est current consumption. The contribution from on-chip
pull-ups on PORTB should be considered.
The MCLR pin must be at a logic high level (V
23.3.1
The device can wake-up from Sleep through one of the
following events:
1.
2.
3.
The following peripheral interrupts can wake the device
from Sleep:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. EEPROM write operation complete.
11. LVD interrupt.
Other peripherals cannot generate interrupts, since
during Sleep, no on-chip clocks are present.
DS39609B-page 252
External Reset input on MCLR pin.
Watchdog Timer Wake-up (if WDT was
enabled).
Interrupt from INT pin, RB port change or a
peripheral interrupt.
PSP read or write.
TMR1 interrupt. Timer1 must be operating as an
asynchronous counter.
TMR3 interrupt. Timer3 must be operating as an
asynchronous counter.
CCP Capture mode interrupt.
Special event trigger (Timer1 in Asynchronous
mode using an external clock).
MSSP (Start/Stop) bit detect interrupt.
MSSP transmit or receive in Slave mode
(SPI/I
USART RX or TX (Synchronous Slave mode).
A/D conversion (when A/D clock source is RC).
Power-down Mode (Sleep)
2
C).
WAKE-UP FROM SLEEP
DD
or V
SS
, ensure no external cir-
DD
or V
SS
IHMC
for low-
).
External MCLR Reset will cause a device Reset. All
other events are considered a continuation of program
execution and will cause a “wake-up”. The TO and PD
bits in the RCON register can be used to determine the
cause of the device Reset. The PD bit, which is set on
power-up, is cleared when Sleep is invoked. The TO bit
is cleared if a WDT time-out occurred (and caused
wake-up).
When the SLEEP instruction is being executed, the next
instruction (PC + 2) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction and then branches to the inter-
rupt address. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
23.3.2
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If an interrupt condition (interrupt flag bit and
• If the interrupt condition occurs during or after
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruction
should be executed before a SLEEP instruction.
interrupt enable bits are set) occurs before the
execution of a SLEEP instruction, the SLEEP
instruction will complete as a NOP. Therefore, the
WDT and WDT postscaler will not be cleared, the
TO bit will not be set and PD bits will not be
cleared.
the execution of a SLEEP instruction, the device
will immediately wake-up from Sleep. The SLEEP
instruction will be completely executed before the
wake-up. Therefore, the WDT and WDT
postscaler will be cleared, the TO bit will be set
and the PD bit will be cleared.
WAKE-UP USING INTERRUPTS
 2004 Microchip Technology Inc.

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