PIC18F8620-I/PT Microchip Technology, PIC18F8620-I/PT Datasheet - Page 360

• Manufacturer Part Number: PIC18F8620-I/PT
• Description: IC MCU FLASH 32KX16 EE 80TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F8620-I/PT

• Core Size: 8-Bit
• Program Memory Size: 64KB (32K x 16)
• Core Processor: PIC
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.75K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TFQFP
• Controller Family/series: PIC18
• No. Of I/o's: 68
• Eeprom Memory Size: 1024Byte
• Ram Memory Size: 3.75KB
• Cpu Speed: 25MHz
• No. Of Timers: 5
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3840 B
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 68
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183022, DM183032
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
• Lead Free Status / Rohs Status: Details

PIC18F6520/8520/6620/8620/6720/8720
28.2
The following sections give the technical details of the packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39609B-page 358
Package Details
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
(F)
CH
A2
E1
D1
n1
A1
A
L
E
D
B
n
p
c
L
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
D1
0
5
5
CH x 45
INCHES
D
NOM
A1
.020
.043
.039
.006
.024
.039
.472
.472
.394
.394
.007
.009
.035
3.5
64
16
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
0
5
5
MILLIMETERS*
 2004 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.15
0.50
1.10
1.00
0.60
1.00
0.18
0.22
0.89
3.5
64
16
10
10
MAX
12.25
12.25
10.10
10.10
A2
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7