DSPIC30F6010-30I/PF Microchip Technology, DSPIC30F6010-30I/PF Datasheet - Page 5

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DSPIC30F6010-30I/PF

Manufacturer Part Number
DSPIC30F6010-30I/PF
Description
IC DSPIC MCU/DSP 144K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F6010-30I/PF

Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TQFP, 80-VQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
68
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300019 - BOARD DEMO DSPICDEM 80L STARTERAC164314 - MODULE SKT FOR PM3 80PFDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F601030IPF

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6010-30I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010-30I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Silicon Errata Issues
1. Module: Data EEPROM
2. Module: CPU
© 2010 Microchip Technology Inc.
Note:
At device throughput is greater than 20 MIPS for
V
V
instructions (TBLRDL/TBLRDH) and instructions
that use Program Space Visibility (PSV) do not
function correctly when reading data from Data
EEPROM.
Work around
When reading data from Data EEPROM, the
application
operation to lower the frequency of the system
clock so that the throughput is less than 20 MIPS.
This may be easily performed at any time via the
Oscillator
(OSCCON<7:6>), that allow the application to
divide the system clock down by a factor of 4, 16
or 64.
Affected Silicon Revisions
The US bit (CORCON<12>) controls whether
MAC-type DSP instructions operate in Signed or
Unsigned mode. The device defaults to a Signed
mode on power-up (US = 0).
For this revision of silicon, MAC-type DSP
instructions do not function as specified in
Unsigned mode (US = 1). Also, for this revision,
the US bit will always read as ‘0’.
Work around
Ensure that the US bit is not set by the application.
In
multiplications, use the MCU Multiply instruction,
MUL.UU.
Affected Silicon Revisions
DD
DD
B1
B1
X
X
in the range 4.75V to 5.5V (or 10 MIPS for
order
in the range 3V to 3.6V), Table Read
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (B2).
B2
B2
X
X
should
to
Postscaler
perform
perform
unsigned
bits,
a
clock-switch
integer
POST
3. Module: CPU
Sequential MAC class instructions, which prefetch
data from Y data space using ±4 address
modification, will cause an address error trap. The
trap occurs only when all of the following
conditions are true:
1. Two sequential MAC class instructions (or a
2. Both instructions prefetch data from Y data
3. Neither
Work around
The problem described above can be avoided by
using any of the following methods:
1. Inserting any other instruction between the two
2. Adding an accumulator write back (a dummy
3. Do not use the + = 4 or - = 4 address
4. Do not prefetch data from Y space data.
Affected Silicon Revisions
B1
X
MAC class instruction executed in a REPEAT or
DO loop) that prefetch from Y data space.
space using the + = 4 or - = 4 address
modification.
accumulator write back.
MAC class instructions.
write back if needed) to either of the MAC class
instructions.
modification.
B2
X
of
dsPIC30F6010
the
instruction
DS80459D-page 5
uses
an

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