P87C660X2BBD,157 NXP Semiconductors, P87C660X2BBD,157 Datasheet - Page 6

• Manufacturer Part Number: P87C660X2BBD,157
• Description: IC 80C51 MCU 16K OTP 44-LQFP
• Manufacturer: NXP Semiconductors
• Series: 87Cr

Specifications of P87C660X2BBD,157

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, I²C, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 44-LQFP
• Processor Series: P87C6x
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, UART
• Maximum Clock Frequency: 16 MHz, 33 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-3204; 935273061157; P87C660X2BBD

1. No internal connection
2. May be left open, but it is recommended to connect V
3. P8xC661X2 devices only, these pins are open-drain and have
Philips Semiconductors
LOGIC SYMBOL
PINNING
Plastic Leaded Chip Carrier
2003 Oct 02
80C51 8-bit microcontroller family
RAM, low voltage (2.7 to 5.5 V), low power, high speed (30/33
MHz), two 400KB I
Pin
10
11
12
13
14
15
V
the same electrical characteristics as P1.6 and P1.7
1
2
3
4
5
6
7
8
9
SS
3 to GND to improve EMC performance
Function
NIC
SDA1
P1.0/T2
P1.1/T2EX
P1.2/ECI
P1.3/CEX0
P1.4/CEX1
P1.5/CEX2
P1.6/SCL0
P1.7/SDA0
RST
P3.0/RxD
V
P3.1/TxD
P3.2/INT0
P3.3/INT1
CEX3/T0
CEX4/T1
SS
1
3
INT0
INT1
3
2
RxD
TxD
(8xC660)/
WR
(8xC661)
RD
ALE/PROG
EA/V
PSEN
17
RST
XTAL1
XTAL2
7
PP
2
Pin
16
17
18
19
20
21
22
23
24
25
26
27
28
29
C interfaces
18
V
6
P8xC660X2/661X2
CC
Function
P3.4/T0/CEX3
P3.5/T1/CEX4
P3.6/WR
P3.7/RD
XTAL2
XTAL1
V
NIC
SCL1
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P2.5/A13
SS
V
1
1
3
1
SS
(8xC660)/
(8xC661)
40
28
16 KB OTP/ROM, 512B
Pin
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
39
29
ADDRESS AND
T2
T2EX
CEX0
CEX1
CEX2
SCL0
SDA0
SCL1
SDA1
ADDRESS BUS
DATA BUS
Function
P2.6/A14
P2.7/A15
PSEN
ALE
V
EA/V
P0.7/AD7
P0.6/AD6
P0.5/AD5
P0.4/AD4
P0.3/AD3
P0.2/AD2
P0.1/AD1
P0.0/AD0
V
SS
CC
SU01737
SU01736
2
PP
2
SS
2 and
6
1. No internal connection
2. May be left open, but it is recommended to connect V
3. P8xC661X2 devices only
Plastic Quad Flat Pack
V
SS
Pin
10
11
12
13
14
15
1
2
3
4
5
6
7
8
9
3 to GND to improve EMC performance
Function
P1.5/CEX2
P1.6/SCL0
P1.7/SDA0
RST
P3.0/RxD
V
P3.1/TxD
P3.2/INT0
P3.3/INT1
P3.4/T0/CEX3
P3.5/T1/CEX4
P3.6/WR
P3.7/RD
XTAL2
XTAL1
SS
3
2
11
1
17
Pin
16
18
19
20
21
22
23
24
25
26
27
28
29
44
12
P8xC660X2/661X2
Function
V
NIC
SCL1
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P2.5/A13
P2.6/A14
P2.7/A15
PSEN
ALE
V
EA/V
P8xC660X2/661X2
SS
SS
1
1
2
3
PP
(8xC660)/
2
(8xC661)
34
22
39
Pin
30
31
32
33
34
35
36
37
38
40
41
42
43
44
33
23
Function
P0.7/AD7
P0.6/AD6
P0.5/AD5
P0.4/AD4
P0.3/AD3
P0.2/AD2
P0.1/AD1
P0.0/AD0
V
NIC
SDA1
P1.0/T2
P1.1/T2EX
P1.2/ECI
P1.3/CEX0
P1.4/CEX1
CC
SU01738
1
3
Product data
(8xC660)/
(8xC661)
SS
2 and