LPC2365FBD100,551 NXP Semiconductors, LPC2365FBD100,551 Datasheet - Page 24

IC ARM7 MCU FLASH 256K 100LQFP

LPC2365FBD100,551

Manufacturer Part Number
LPC2365FBD100,551
Description
IC ARM7 MCU FLASH 256K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2365FBD100,551

Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
58K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
32 bit
Data Ram Size
58 KB
Interface Type
CAN, I2C, I2S, SPI, SSP, UART, USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 6 Channel
On-chip Dac
10 bit, 1 Channel
Package
100LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-4409
935286017551
LPC2365FBD100-S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2365FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC2365FBD100,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC2364_65_66_67_68_6
Product data sheet
7.13.1 Features
7.14.1 Features
7.15.1 Features
7.13 10-bit DAC
7.14 UARTs
7.15 SPI serial I/O controller
The DAC allows the LPC2364/65/66/67/68 to generate a variable analog output. The
maximum output value of the DAC is V
The LPC2364/65/66/67/68 each contain four UARTs. In addition to standard transmit and
receive data lines, UART1 also provides a full modem control handshake interface.
The UARTs include a fractional baud rate generator. Standard baud rates such as
115 200 Bd can be achieved with any crystal frequency above 2 MHz.
The LPC2364/65/66/67/68 each contain one SPI controller. SPI is a full duplex serial
interface designed to handle multiple masters and slaves connected to a given bus. Only
a single master and a single slave can communicate on the interface during a given data
transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the
slave, and the slave always sends 8 bits to 16 bits of data to the master.
10-bit DAC
Resistor string architecture
Buffered output
Power-down mode
Selectable output drive
16 B Receive and Transmit FIFOs.
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
Fractional divider for baud rate control, auto baud capabilities and FIFO control
mechanism that enables software flow control implementation.
UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS).
UART3 includes an IrDA mode to support infrared communication.
Compliant with SPI specification
Synchronous, serial, full duplex communication
Combined SPI master and slave
Maximum data bit rate of one eighth of the input clock rate
8 bits to 16 bits per transfer
Rev. 06 — 1 February 2010
i(VREF)
.
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
© NXP B.V. 2010. All rights reserved.
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