LPC2365FBD100,551 NXP Semiconductors, LPC2365FBD100,551 Datasheet - Page 53

• Manufacturer Part Number: LPC2365FBD100,551
• Description: IC ARM7 MCU FLASH 256K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2365FBD100,551

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 58K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 32 bit
• Data Ram Size: 58 KB
• Interface Type: CAN, I2C, I2S, SPI, SSP, UART, USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 6 Channel
• On-chip Dac: 10 bit, 1 Channel
• Package: 100LQFP
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4409; 935286017551; LPC2365FBD100-S

NXP Semiconductors
Fig 20. Package outline SOT926-1 (TFBGA100)
LPC2364_65_66_67_68_6
Product data sheet
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT926-1
VERSION
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
G
K
H
D
C
B
A
F
E
J
0.65
0.8
A
2
1
IEC
- - -
2
0.5
0.4
b
e
3
9.1
8.9
4
D
5
e
D
1
9.1
8.9
JEDEC
6
E
- - -
1/2 e
7
REFERENCES
0.8
e
8
Rev. 06 — 1 February 2010
b
9
0
7.2
e
10
1
JEITA
7.2
e
- - -
2
1/2 e
scale
B
e
2.5
∅ v
∅ w
0.15
v
M
M
e
A
E
2
C
C
0.05
A
w
5 mm
A
B
0.08
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
A
y
1
A
2
0.1
y
1
y
1
C
detail X
PROJECTION
EUROPEAN
X
C
y
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
05-12-09
05-12-22
SOT926-1
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