LPC2365FBD100,551 NXP Semiconductors, LPC2365FBD100,551 Datasheet - Page 6

IC ARM7 MCU FLASH 256K 100LQFP

LPC2365FBD100,551

Manufacturer Part Number
LPC2365FBD100,551
Description
IC ARM7 MCU FLASH 256K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2365FBD100,551

Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
58K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
32 bit
Data Ram Size
58 KB
Interface Type
CAN, I2C, I2S, SPI, SSP, UART, USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 6 Channel
On-chip Dac
10 bit, 1 Channel
Package
100LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-4409
935286017551
LPC2365FBD100-S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2365FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC2365FBD100,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
6. Pinning information
Table 3.
LPC2364_65_66_67_68_6
Product data sheet
Pin Symbol
Row A
1
5
9
Row B
1
TDO
P1[10]/ENET_RXD1
P0[7]/I2STX_CLK/
SCK1/MAT2[1]
TMS
Pin allocation table
6.1 Pinning
Fig 2.
Fig 3.
Pin Symbol
2
6
10
2
LPC2364/68 pinning TFBGA100 package
LPC2364/65/66/67/68 pinning
P0[3]/RXD0
P1[16]/ENET_MDC
P0[9]/I2STX_SDA/
MOSI1/MAT2[3]
RTCK
Rev. 06 — 1 February 2010
ball A1
index area
25
G
C
D
H
A
B
E
F
K
1
J
LPC2364FET100/LPC2368FET100
Pin Symbol
3
7
11
3
1
LPC2364FBD100
LPC2365FBD100
LPC2366FBD100
LPC2367FBD100
LPC2368FBD100
2
V
V
-
V
DD(3V3)
DD(DCDC)(3V3)
SS
3
Transparent top view
4
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
5
6
7
002aac576
75
8
51
002aad225
9
10
Pin Symbol
4
8
12
4
P1[4]/ENET_TX_EN
P0[4]/I2SRX_CLK/
RD2/CAP2[0]
-
P1[1]/ENET_TXD1
© NXP B.V. 2010. All rights reserved.
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