LPC2365FBD100,551 NXP Semiconductors, LPC2365FBD100,551 Datasheet - Page 38

• Manufacturer Part Number: LPC2365FBD100,551
• Description: IC ARM7 MCU FLASH 256K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2365FBD100,551

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 58K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 32 bit
• Data Ram Size: 58 KB
• Interface Type: CAN, I2C, I2S, SPI, SSP, UART, USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 6 Channel
• On-chip Dac: 10 bit, 1 Channel
• Package: 100LQFP
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4409; 935286017551; LPC2365FBD100-S

NXP Semiconductors
9. Static characteristics
Table 6.
T
LPC2364_65_66_67_68_6
Product data sheet
Symbol
V
V
V
V
V
I
I
I
I
I
Standard port pins, RESET, RTCK
I
I
I
DD(DCDC)act(3V3)
DD(DCDC)pd(3V3)
DD(DCDC)dpd(3V3)
BATact
BAT
IL
IH
OZ
amb
DD(3V3)
DD(DCDC)(3V3)
DDA
i(VBAT)
i(VREF)
=
−
40
°
Static characteristics
C to +85
Parameter
supply voltage (3.3 V)
DC-to-DC converter
supply voltage (3.3 V)
analog 3.3 V pad supply
voltage
input voltage on pin
VBAT
input voltage on pin
VREF
active mode DC-to-DC
converter supply
current (3.3 V)
Power-down mode
DC-to-DC converter
supply current (3.3 V)
Deep power-down
mode DC-to-DC
converter supply
current (3.3 V)
active mode battery
supply current
battery supply current
LOW-level input current V
HIGH-level input
current
OFF-state output
current
°
C for standard devices,
Conditions
core and external rail
V
T
executed from flash; no
peripherals enabled;
PCLK = CCLK
all peripherals enabled;
PCLK = CCLK / 8
all peripherals enabled;
PCLK = CCLK
V
T
Deep power-down mode
V
pull-down
V
no pull-up/down
amb
amb
DD(DCDC)(3V3)
DD(DCDC)(3V3)
I
I
O
CCLK = 10 MHz
CCLK = 72 MHz
CCLK = 10 MHz
CCLK = 72 MHz
CCLK = 10 MHz
CCLK = 72 MHz
= 0 V; no pull-up
= V
−
= 0 V; V
40
while(1){}
= 25 °C; code
= 25 °C
Rev. 06 — 1 February 2010
DD(3V3)
°
C to +125
O
; no
= V
= 3.3 V;
= 3.3 V;
DD(3V3)
°
C for LPC2364HBD only, unless otherwise specified.
;
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
[2]
[3]
[3]
[4]
[3]
Min
3.0
3.0
3.0
2.0
2.5
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ
3.3
3.3
3.3
3.3
3.3
15
63
21
92
27
125
113
20
20
20
-
-
-
[1]
© NXP B.V. 2010. All rights reserved.
Max
3.6
3.6
3.6
3.6
V
-
-
-
-
-
-
-
-
-
-
3
3
3
DDA
38 of 59
Unit
V
V
V
V
V
mA
mA
mA
mA
mA
mA
μA
μA
μA
μA
μA
μA
μA