MC9S12XEP100CAG Freescale Semiconductor, MC9S12XEP100CAG Datasheet - Page 1152

• Manufacturer Part Number: MC9S12XEP100CAG
• Description: IC MCU 16BIT 1M FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEP100CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 64 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 24-ch x 12-bit
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Package: 144LQFP
• Family Name: HCS12X
• Maximum Speed: 50 MHz
• Operating Supply Voltage: 1.8|2.8|5 V
• For Use With: EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2)
29.3.2
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013. A summary of the Flash module registers is given in
descriptions in the following subsections.
1152
FERCNFG
FCCOBIX
FECCRIX
FCLKDIV
Address
& Name
FCNFG
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
FSEC
1. Duplicate value used if primary value generates a double bit fault when read during the reset sequence.
0x12_0000 – 0x12_0001
0x12_0002 – 0x12_0003
0x12_0004 – 0x12_0005
0x12_0006 – 0x12_0007
0x12_0008 – 0x12_007F
Global Address
(EEEIFRON)
Register Descriptions
W
W
W
W
W
W
R
R
R
R
R
R
Writes to any Flash register must be avoided while a Flash command is
active (CCIF=0) to prevent corruption of Flash register contents and
Memory Controller behavior.
ERSERIE
KEYEN1
FDIVLD
CCIE
7
0
0
Table 29-7. EEE Nonvolatile Information Register Fields
PGMERIE
KEYEN0
(Bytes)
FDIV6
Figure 29-4. FTM1024K5 Register Summary
MC9S12XE-Family Reference Manual , Rev. 1.23
Size
120
6
0
0
0
2
2
2
2
D-Flash User Partition (DFPART)
Refer to
D-Flash User Partition (duplicate
Buffer RAM EEE Partition (ERPART)
Refer to
Buffer RAM EEE Partition (duplicate
Reserved
FDIV5
RNV5
5
0
0
0
0
Section 29.4.2.15, “Full Partition D-Flash
Section 29.4.2.15, “Full Partition D-Flash
CAUTION
EPVIOLIE
IGNSF
FDIV4
RNV4
4
0
0
ERSVIE1
FDIV3
RNV3
Description
3
0
0
0
(1)
)
1
)
CCOBIX2
ECCRIX2
ERSVIE0
Figure 29-4
FDIV2
RNV2
2
0
Command”
Command”
Freescale Semiconductor
CCOBIX1
ECCRIX1
DFDIE
FDIV1
FDFD
SEC1
with detailed
1
CCOBIX0
ECCRIX0
FDIV0
SFDIE
SEC0
FSFD
0