MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 148

• Manufacturer Part Number: MC56F8367VPYE
• Description: IC DSP 16BIT 60MHZ 160-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8367VPYE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 76
• Program Memory Size: 544KB (272K x 16)
• Program Memory Type: FLASH
• Ram Size: 18K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 160-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 60MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 36KB
• # I/os (max): 76
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 4(4-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 160
• Package Type: LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 60 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 76
• Data Ram Size: 36 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8367EVME
• Minimum Operating Temperature: - 40 C
• Package: 160LQFP
• Family Name: 56F8xxx
• Maximum Speed: 60 MHz
• Number Of Timers: 4
• For Use With: MC56F8367EVME - EVAL BOARD FOR MC56F83X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

10.7 Crystal Oscillator Timing
10.8 External Memory Interface Timing
The External Memory Interface is designed to access static memory and peripheral devices.
shows sample timing and parameters that are detailed in
The timing of each parameter consists of both a fixed delay portion and a clock related portion, as well as
user controlled wait states. The equation:
When using the XTAL clock input directly as the chip clock without prescaling (ZSRC selects prescaler
clock and prescaler set to
input. In this situation only, parameter values must be adjusted for the duty cycle at XTAL. DCAOE and
DCAEO are used to make this duty cycle adjustment where needed.
148
Crystal Start-up time
Resonator Start-up time
Crystal ESR
Crystal Peak-to-Peak Jitter
Crystal Min-Max Period Variation
Resonator Peak-to-Peak Jitter
Resonator Min-Max Period Variation
Bias Current, high-drive mode
Bias Current, low-drive mode
Quiescent Current, power-down mode
should be used to determine the actual time of each parameter. The terms in this equation are defined as:
t
D
P
M
W
Characteristic
t = D + P * (M + W)
= Parameter delay time
= Fixed portion of the delay, due to on-chip path delays
= Period of the system clock, which determines the execution rate of the part
= Fixed portion of a clock period inherent in the design; this number is adjusted to account
= Sum of the applicable wait state controls. The “Wait State Controls” column of
(i.e., when the device is operating at 60MHz, P = 16.67 ns)
for possible derating of clock duty cycle
Table 10-16
the 56F8300 Peripheral User Manual details what each wait state field controls.
Table 10-15 Crystal Oscillator Parameters
÷ 1),
the EMI quadrature clock is generated using both edges of the EXTAL clock
shows the applicable controls for each parameter and the EMI chapter of
56F8367 Technical Data, Rev. 8
Symbol
I
I
R
BIASH
BIASL
T
T
T
T
T
I
T
ESR
PD
CS
RS
PV
RP
RJ
D
0.12
Min
0.1
70
—
—
—
—
—
—
4
Table
10-16.
0.18
Typ
250
80
—
—
—
—
—
5
0
Max
120
250
300
300
290
110
1.5
10
1
1
Freescale Semiconductor
ohms
Unit
ms
ms
μA
μA
μA
ps
ns
ps
ps
Figure 10-4
Preliminary