MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 40

• Manufacturer Part Number: MC56F8367VPYE
• Description: IC DSP 16BIT 60MHZ 160-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8367VPYE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 76
• Program Memory Size: 544KB (272K x 16)
• Program Memory Type: FLASH
• Ram Size: 18K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 160-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 60MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 36KB
• # I/os (max): 76
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 4(4-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 160
• Package Type: LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 60 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 76
• Data Ram Size: 36 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8367EVME
• Minimum Operating Temperature: - 40 C
• Package: 160LQFP
• Family Name: 56F8xxx
• Maximum Speed: 60 MHz
• Number Of Timers: 4
• For Use With: MC56F8367EVME - EVAL BOARD FOR MC56F83X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

start-up. The crystal and associated components should be mounted as near as possible to the EXTAL and
XTAL pins to minimize output distortion and start-up stabilization time.
Note:
3.2.2
It is also possible to drive the internal oscillator with a ceramic resonator, assuming the overall system
design can tolerate the reduced signal integrity. A typical ceramic resonator circuit is shown in
Refer to the supplier’s recommendations when selecting a ceramic resonator and associated components.
The resonator and components should be mounted as near as possible to the EXTAL and XTAL pins.
Note:
3.2.3
The recommended method of connecting an external clock is given in
source is connected to XTAL and the EXTAL pin is grounded. When using an external clock source, set
40
CLKMODE = 0
2 Terminal
CL1
The OCCS_COHL bit must be set to 1 when a crystal oscillator is used. The reset condition on the
OCCS_COHL bit is 0. Please see the COHL bit in the Oscillator Control (OSCTL) register, discussed
in the 56F8300 Peripheral User Manual.
Ceramic Resonator (Default)
The OCCS_COHL bit must be set to 0 when a ceramic resonator is used. The reset condition on the
OCCS_COHL bit is 0. Please see the COHL bit in the Oscillator Control (OSCTL) register, discussed
in the 56F8300 Peripheral User Manual.
External Clock Source
EXTAL
CL1
R
Z
EXTAL
XTAL
CL2
Figure 3-2 Connecting to a Crystal Oscillator
R
Figure 3-3 Connecting a Ceramic Resonator
Z
Resonator Frequency = 4 - 8MHz (optimized for 8MHz)
XTAL
Crystal Frequency = 4 - 8MHz (optimized for 8MHz)
CL2
EXTAL
3 Terminal
C1
EXTAL
56F8367 Technical Data, Rev. 8
R
R
Z
XTAL
Z
XTAL
C2
Sample External Ceramic Resonator Parameters:
R
z
Sample External Crystal Parameters:
R
Note: If the operating temperature range is limited to
below 85
= 750 KΩ
z
= 750 KΩ
o
C (105
CLKMODE = 0
o
C junction), then R
Figure
3-4. The external clock
Freescale Semiconductor
z
= 10 Meg Ω
Figure
Preliminary
3-3.