MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 166

• Manufacturer Part Number: MC56F8367VPYE
• Description: IC DSP 16BIT 60MHZ 160-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8367VPYE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 76
• Program Memory Size: 544KB (272K x 16)
• Program Memory Type: FLASH
• Ram Size: 18K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 160-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 60MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 36KB
• # I/os (max): 76
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 4(4-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 160
• Package Type: LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 60 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 76
• Data Ram Size: 36 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8367EVME
• Minimum Operating Temperature: - 40 C
• Package: 160LQFP
• Family Name: 56F8xxx
• Maximum Speed: 60 MHz
• Number Of Timers: 4
• For Use With: MC56F8367EVME - EVAL BOARD FOR MC56F83X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Part 11 Packaging
Note: The 160 Map Ball Grid Array is not available in the 56F8167 device.
11.1 56F8367 Package and Pin-Out Information
This section contains package and pin-out information for the 56F8367. This device comes in a 160-pin
Low-profile Quad Flat Pack (LQFP) and 160 Map Ball Grid Array.
lay-out for the 160-pin LQFP, and
mechanical parameters for the LQFP package and
pin-out for the 160-pin LQFP and
166
* When the on-chip regulator is disabled, these four pins become 2.5V V
PHASEA1
PHASEB1
GPIOB0
GPIOB1
GPIOB2
GPIOB3
INDEX1
HOME1
GPIOB4
PWMB0
PWMB1
PWMB2
V
V
V
V
CLKO
RXD0
DD_IO
TXD0
DD_IO
DD_IO
V
CAP
D10
A10
A11
A12
A13
A14
A15
V
PP
A1
A2
A3
A4
A5
A6
A7
A8
D7
D8
D9
A9
SS
2
4
Pin 1
41
Figure 11-1 Top View, 56F8367 160-Pin LQFP Package
Orientation Mark
Table 11-2
Figure 11-2
56F8367 Technical Data, Rev. 8
lists the pin-out for the 160 MAPBGA.
DD_CORE
for the160 Map Ball Grid Array.
Figure 11-3
.
for the MAPBGA,
Figure 11-1
81
121
Figure 11-5
Freescale Semiconductor
Table 11-1
shows the package
ANB1
RSTO
FAULTA3
D3
FAULTA2
FAULTA1
D2
FAULTA0
PWMA5
ANB4
ANB3
ANB2
ANB0
V
V
V
V
V
V
V
TEMP_SENSE
ANA7
ANA6
ANA5
ANA4
ANA3
ANA2
ANA1
ANA0
CLKMODE
RESET
V
V
EXTAL
XTAL
VDDA_OSC_PLL
OCR_DIS
D6
D5
D4
SSA_ADC
DDA_ADC
DD_IO
REFH
REFP
REFMID
REFN
REFLO
CAP
3
shows the
Preliminary
lists the