PIC18F4331-I/P Microchip Technology, PIC18F4331-I/P Datasheet - Page 143

IC PIC MCU FLASH 4KX16 40DIP

PIC18F4331-I/P

Manufacturer Part Number
PIC18F4331-I/P
Description
IC PIC MCU FLASH 4KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4331-I/P

Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
36
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC18
No. Of I/o's
36
Eeprom Memory Size
256Byte
Ram Memory Size
768Byte
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART, I2C, SPI, SSP
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
9 bit
Package
40PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4431 - BOARD DAUGHTER ICEPIC3DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCUACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F4331-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F4331-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
12.2
A crystal oscillator circuit is built-in between pins T1OSI
(input) and T1OSO (amplifier output). It is enabled by
setting control bit, T1OSCEN (T1CON<3>). The oscil-
lator is a low-power oscillator rated for 32 kHz crystals.
It will continue to run during all power-managed modes.
The circuit for a typical LP oscillator is shown in
Figure 12-3. Table 12-1 shows the capacitor selection
for the Timer1 oscillator.
The user must provide a software time delay to ensure
proper start-up of the Timer1 oscillator.
FIGURE 12-3:
TABLE 12-1:
© 2007 Microchip Technology Inc.
Osc Type
Note 1: Microchip suggests this value as a starting
Note:
LP
2: Higher capacitance increases the stability
3: Since each resonator/crystal has its own
4: Capacitor values are for design guidance
Timer1 Oscillator
33 pF
33 pF
C1
C2
See the notes with Table 12-1 for additional
information about capacitor selection.
point in validating the oscillator circuit.
of the oscillator, but also increases the
start-up time.
characteristics, the user should consult
the resonator/crystal manufacturer for
appropriate
components.
only.
32 kHz
32.768 kHz
XTAL
Freq
CAPACITOR SELECTION FOR
THE TIMER OSCILLATOR
EXTERNAL
COMPONENTS FOR THE
TIMER1 LP OSCILLATOR
values
T1OSI
27 pF
T1OSO
C1
PIC18FXXXX
(1)
of
27 pF
PIC18F2331/2431/4331/4431
external
C2
(1)
Preliminary
12.3
The Timer1 oscillator for PIC18F2331/2431/4331/4431
devices incorporates an additional low-power feature.
When this option is selected, it allows the oscillator to
automatically reduce its power consumption when the
microcontroller is in Sleep mode. During normal device
operation, the oscillator draws full current. As high
noise environments may cause excessive oscillator
instability in Sleep mode, this option is best suited for
low noise applications, where power conservation is an
important design consideration.
The low-power option is enabled by clearing the
T1OSCMX bit (CONFIG3L<5>). By default, the option
is disabled, which results in a more or less constant
current draw for the Timer1 oscillator.
Due to the low-power nature of the oscillator, it may
also be sensitive to rapidly changing signals in close
proximity.
The oscillator circuit, shown in Figure 12-3, should be
located as close as possible to the microcontroller.
There should be no circuits passing within the oscillator
circuit boundaries other than V
If a high-speed circuit must be located near the oscilla-
tor (such as the CCP1 pin in Output Compare or PWM
mode, or the primary oscillator using the OSC2 pin), a
grounded guard ring around the oscillator circuit, as
shown in Figure 12-4, may be helpful when used on a
single-sided PCB or in addition to a ground plane.
FIGURE 12-4:
Note: Not drawn to scale.
Timer1 Oscillator Layout
Considerations
OSCILLATOR CIRCUIT
WITH GROUNDED GUARD
RING
SS
V
OSC1
RC0
V
OSC2
RC1
RC2
or V
DD
SS
DS39616C-page 141
DD
.

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