MC9S12C32MFUE25 Freescale Semiconductor, MC9S12C32MFUE25 Datasheet - Page 683

• Manufacturer Part Number: MC9S12C32MFUE25
• Description: IC MCU 32K FLASH 25MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12C32MFUE25

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-QFP
• Processor Series: S12C
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 60
• Number Of Timers: 8
• Operating Supply Voltage: 3.3 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68EVB912C32EE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• For Use With: CML12C32SLK - KIT STUDENT LEARNING 16BIT HCS12
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

C.1.2
Freescale Semiconductor
SEATING
PLANE
-H-
-T-
-L-
52-Pin LQFP Package
C
13
1
4X
52
14
Figure C-2. 52-Pin LQFP Mechanical Dimensions (Case no. 848D-03)
0.20 (0.008) H L-M
S1
C2
A1
C1
VIEW AA
0.05 (0.002)
A
S
3X
4X
4X
-N-
N
VIEW Y
θ2
θ3
S
MC9S12C-Family / MC9S12GC-Family
40
26
Z
39
27
E
K
W
4X 13 TIPS
θ1
0.20 (0.008) T L-M
-M-
θ
Rev 01.24
B1
VIEW AA
2X R
V1
GAGE PLANE
0.10 (0.004) T
0.25 (0.010)
R1
B
V
N
NOTES:
1.
2.
C L
PLATING
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER
DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-.
DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-.
DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -H-
DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD
OR PROTRUSION 0.07 (0.003).
0.13 (0.005)
ROTATED 90
DIM
θ2
A1
B1
C1
C2
R1
S1
V1
θ1
θ3
W
A
B
C
D
E
G
K
S
U
V
θ
F
J
Z
J
SECTION AB-AB
AB
AB
MILLIMETERS
MIN
0.05
1.30
0.20
0.45
0.22
0.07
0.08
0.09
10.00 BSC
10.00 BSC
12.00 BSC
12.00 BSC
0
0
5.00 BSC
5.00 BSC
0.65 BSC
0.50 REF
6.00 BSC
6.00 BSC
0.20 REF
1.00 REF
---
12
12
Appendix C Package Information
°
°
°
°
VIEW Y
M
REF
REF
D
°
MAX
F
1.70
0.20
1.50
0.40
0.75
0.35
0.20
0.20
0.16
7
---
T
CLOCKWISE
°
L-M
0.002
0.051
0.008
0.018
0.009
0.003
0.003
0.004
MIN
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
0.026 BSC
0.020 REF
0.472 BSC
0.236 BSC
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
0
0
---
12
INCHES
°
°
12
S
°
°
U
REF
REF
0.008
N
0.067
0.059
0.016
0.030
0.014
0.008
0.008
0.006
MAX
BASE METAL
---
7
°
X=L, M, N
S
G
-X-
683