PIC16F72-I/SOG Microchip Technology, PIC16F72-I/SOG Datasheet - Page 91

• Manufacturer Part Number: PIC16F72-I/SOG
• Description: IC PIC MCU FLASH 2KX14 28-SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F72-I/SOG

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

14.1
© 2007 Microchip Technology Inc.
PIC16LF72
PIC16F72
D001
D001
D001A
D002*
D003
D004*
D005
Note 1: This is the limit to which V
Param
(Industrial)
(Industrial, Extended)
No.
*
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through R
5: Timer1 oscillator (when enabled) adds approximately 20 μA to the specification. This value is from
6: The Δ current is the additional current consumed when this peripheral is enabled. This current should be
7: When BOR is enabled, the device will operate correctly until the V
DC Characteristics: PIC16F72 (Industrial, Extended)
V
V
V
SV
V
Sym
These parameters are characterized but not tested.
and are not tested.
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption. The test conditions for all I
are:
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
estimated by the formula Ir = V
characterization and is for design guidance only. This is not tested.
added to the base I
DD
DR
POR
BOR
DD
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
Supply Voltage
RAM Data Retention
Voltage (Note 1)
V
ensure internal Power-on
Reset signal
V
internal Power-on Reset
signal
Brown-out Reset Voltage
DD
DD
Start Voltage to
Rise Rate to ensure
DD
Characteristic
; WDT enabled/disabled as specified.
DD
or I
PIC16LF72
PIC16F72
PIC16LF72 (Industrial)
PD
DD
measurement.
can be lowered without losing RAM data.
DD
/2R
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
V
0.05
3.65
Min
EXT
2.0
2.5
2.2
4.0
BOR
—
—
*
(mA) with R
Typ† Max Units
EXT
V
1.5
4.0
—
—
—
—
—
—
SS
is not included. The current through the resistor can be
4.35
5.5
5.5
5.5
5.5
5.5
—
—
—
EXT
V/ms See section on Power-on Reset for details
in kΩ.
V
V
V
V
V
V
V
V
-40°C ≤ T
DD
A/D not used, -40°C to +85°C
A/D in use, -40°C to +85°C
A/D in use, 0°C to +85°C
All configurations
BOR enabled (Note 7)
See section on Power-on Reset for details
BOREN bit in configuration word enabled
measurements in active Operation mode
BOR
A
A
A
voltage trip point is reached.
≤ +85°C for industrial
≤ +85°C for industrial
≤ +125°C for extended
Conditions
DD
PIC16F72
DS39597C-page 89
DD
and V
SS
.