DSPIC33FJ12MC202-I/SP Microchip Technology, DSPIC33FJ12MC202-I/SP Datasheet - Page 13
![IC DSPIC MCU/DSP 12K 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
DSPIC33FJ12MC202-I/SP
Manufacturer Part Number
DSPIC33FJ12MC202-I/SP
Description
IC DSPIC MCU/DSP 12K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.DSPIC33FJ12MC201-ISO.pdf
(288 pages)
3.DSPIC33FJ12MC201-ISO.pdf
(14 pages)
4.DSPIC33FJ12MC202-IML.pdf
(282 pages)
Specifications of DSPIC33FJ12MC202-I/SP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (12K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
I2C, JTAG, SPI, UART
No. Of I/o's
21
Flash Memory Size
12KB
Supply Voltage Range
3V To 3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164337 - MODULE SOCKET FOR PM3 40DIPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
- PIC24HJ12GP201-ISO PDF datasheet
- DSPIC33FJ12MC201-ISO PDF datasheet #2
- DSPIC33FJ12MC201-ISO PDF datasheet #3
- DSPIC33FJ12MC202-IML PDF datasheet #4
- Current page: 13 of 288
- Download datasheet (5Mb)
2.0
2.1
Getting started with the dsPIC33FJ12MC201/202
family of 16-bit Digital Signal Controllers (DSC)
requires attention to a minimal set of device pin
connections before proceeding with development. The
following is a list of pin names, which must always be
connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2009 Microchip Technology Inc.
Note:
(see Section 2.2 “Decoupling Capacitors”)
is not used)
(see Section 2.2 “Decoupling Capacitors”)
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (V
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
reference for ADC module is implemented
Note:
REF
CAP
DD
+/V
/V
DD
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
This data sheet summarizes the features
of the dsPIC33FJ12MC201/202 family of
devices. It is not intended to be a
comprehensive
complement the information in this data
sheet, refer to the “dsPIC33F Family
Reference Manual”, which is available
from
(www.microchip.com).
The AV
connected independent of the ADC
voltage reference source.
- pins used when external voltage
CAP
SS
SS
pins
/V
the
DD
DDCORE
pins (regardless if ADC module
and AV
Microchip
reference
)”)
SS
pins must be
source.
web
site
Preliminary
To
dsPIC33FJ12MC201/202
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70265D-page 11
SS
, AV
DD
, and
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