AT32UC3L064-AUT Atmel, AT32UC3L064-AUT Datasheet - Page 73
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AT32UC3L064-AUT
Manufacturer Part Number
AT32UC3L064-AUT
Description
MCU AVR32 64KB FLASH 48TQFP
Manufacturer
Atmel
Series
AVR®32 UC3r
Datasheets
1.ATAVRONE-PROBECBL.pdf
(16 pages)
2.AT32UC3L-EK.pdf
(858 pages)
3.AT32UC3L016-D3HT.pdf
(110 pages)
Specifications of AT32UC3L064-AUT
Core Processor
AVR
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, PWM, WDT
Number Of I /o
36
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.62 V ~ 3.6 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TQFP, 48-VQFP
Processor Series
AT32UC3x
Core
AVR32
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
SPI/TWI/USART
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
36
Number Of Timers
7
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL
Development Tools By Supplier
AT32UC3L-EK
Minimum Operating Temperature
- 40 C
On-chip Adc
9-ch x 10-bit
Package
48TQFP
Device Core
AVR32
Family Name
AT32
Maximum Speed
50 MHz
Operating Supply Voltage
1.8|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT32UC3L064-AUT
Manufacturer:
HONGFA
Quantity:
30 000
Part Number:
AT32UC3L064-AUT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
8. Mechanical Characteristics
8.1
8.1.1
8.1.2
32099F–11/2010
Thermal Considerations
Thermal Data
Junction Temperature
Table 8-1
Table 8-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
Table
42.
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
=
8-1.
summarizes the thermal resistance data depending on the package.
T
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
JA
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
AT32UC3L016/32/64
TLLGA48
TLLGA48
Package
TQFP48
TQFP48
QFN48
QFN48
Section 7.5 on page
Table
30.06
63.2
21.8
28.3
TBD
Typ
2.5
8-1.
J
°C/W
°C/W
°C/W
in °C.
Unit
73