DSPIC33FJ64GS606-E/MR Microchip Technology, DSPIC33FJ64GS606-E/MR Datasheet - Page 377
![MCU/DSP 16BIT 64KB FLASH 64QFN](/photos/12/13/121325/c04-149_mr_sml.jpg)
DSPIC33FJ64GS606-E/MR
Manufacturer Part Number
DSPIC33FJ64GS606-E/MR
Description
MCU/DSP 16BIT 64KB FLASH 64QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ32GS406-IPT.pdf
(418 pages)
Specifications of DSPIC33FJ64GS606-E/MR
Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
64-VFQFN, Exposed Pad
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
Number Of I /o
58
Ram Size
9K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Numeric And Arithmetic Format
Fixed-Point or Floating-Point
Instruction Set Architecture
Harvard
Device Million Instructions Per Second
40 MIPs
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
58
Data Ram Size
4 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
On-chip Dac
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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TABLE 27-33: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
2010 Microchip Technology Inc.
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
SP60
Note 1:
Param
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
No.
2:
3:
4:
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ
TscH2ssH
TscL2ssH
TssL2doV
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
Symbol
SCKx Input Low Time
SCKx Input High Time
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SSx to SCKx or SCKx
Input
SSx to SDO
High-Impedance
SSx after SCKx Edge
SDOx Data Output Valid after
SSx Edge
Characteristic
X
Output
(1)
Preliminary
1.5 T
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
120
30
30
20
20
10
CY
—
—
—
—
—
—
+ 40
Typ
10
10
—
—
—
—
—
—
—
—
—
—
—
(2)
Max
25
25
30
50
50
—
—
—
—
—
—
—
—
-40°C T
-40°C T
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
+85°C for Industrial
+125°C for Extended
See Note 3
See Note 3
See parameter
D032 and Note 3
See parameter
D031 and Note 3
See Note 4
DS70591C-page 377
Conditions
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