PIC24FJ256GA108-E/PT Microchip Technology, PIC24FJ256GA108-E/PT Datasheet - Page 270
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC24FJ256GA108-E/PT
Manufacturer Part Number
PIC24FJ256GA108-E/PT
Description
IC PIC MCU FLASH 256KB 80-TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ128GA008-IPT.pdf
(12 pages)
2.PIC24FJ128GA106-IPT.pdf
(14 pages)
3.PIC24FJ128GA106-IPT.pdf
(330 pages)
4.PIC24FJ128GA106-IPT.pdf
(52 pages)
5.PIC24FJ128GA110-EPT.pdf
(310 pages)
Specifications of PIC24FJ256GA108-E/PT
Program Memory Type
FLASH
Program Memory Size
256KB (85.5K x 24)
Package / Case
80-TFQFP
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
69
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
68
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA240015 - BOARD MCV PIM FOR 24F256GADM240011 - KIT STARTER MPLAB FOR PIC24F MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24FJ256GA108-E/PT
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
PIC24FJ256GA108-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC24FJ128GA008-IPT PDF datasheet
- PIC24FJ128GA106-IPT PDF datasheet #2
- PIC24FJ128GA106-IPT PDF datasheet #3
- PIC24FJ128GA106-IPT PDF datasheet #4
- PIC24FJ128GA110-EPT PDF datasheet #5
- Current page: 270 of 330
- Download datasheet (3Mb)
PIC24FJ256GA110 FAMILY
28.1
FIGURE 28-1:
TABLE 28-1:
TABLE 28-2:
DS39905E-page 270
PIC24FJ256GA110 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 14x14x1 mm TQFP
Package Thermal Resistance, 12x12x1 mm TQFP
Package Thermal Resistance, 10x10x1 mm TQFP
Package Thermal Resistance, 9x9x0.9 mm QFN
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
For frequencies between 16 MHz and 32 MHz, F
Note 1:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance, Theta-
= ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
When the voltage regulator is disabled, V
V
x (I
DD
DDCORE
3.00V
2.75V
2.50V
2.25V
2.00V
PIC24FJ256GA110 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
Characteristic
– I
OH
V
} x I
Rating
OH
DD
OH
)
16 MHz
3.6V.
) + (V
OL
x I
OL
PIC24FJXXXGA1XX
)
Frequency
MAX
JA
DD
(
= (64 MHz/V) * (V
JA
and V
) numbers are achieved by package simulations.
Symbol
Symbol
P
DDCORE
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
must be maintained so that
DDCORE
50.0
69.4
76.6
28.0
Min
Typ
-40
-40
(T
2010 Microchip Technology Inc.
P
32 MHz
– 2V) + 16 MHz.
J
INT
– T
Max
Typ
—
—
—
—
—
—
+ P
A
)/
2.75V
2.25V
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
+140
+125
Max
Unit
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W
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