PIC18F4525-E/ML Microchip Technology, PIC18F4525-E/ML Datasheet - Page 33
![IC MCU FLASH 24KX16 44QFN](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC18F4525-E/ML
Manufacturer Part Number
PIC18F4525-E/ML
Description
IC MCU FLASH 24KX16 44QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F2525-ISO.pdf
(412 pages)
3.PIC18F2525-ISO.pdf
(18 pages)
4.PIC18F2525-ISO.pdf
(18 pages)
5.PIC18F2525-ISO.pdf
(6 pages)
6.PIC18F2525-ISO.pdf
(6 pages)
Specifications of PIC18F4525-E/ML
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-QFN
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3986 B
Interface Type
SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, 53275-917, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
13 bit
For Use With
I3DB18F4620 - BOARD DAUGHTER ICEPIC3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC18F2221-ISO PDF datasheet
- PIC18F2525-ISO PDF datasheet #2
- PIC18F2525-ISO PDF datasheet #3
- PIC18F2525-ISO PDF datasheet #4
- PIC18F2525-ISO PDF datasheet #5
- PIC18F2525-ISO PDF datasheet #6
- Current page: 33 of 412
- Download datasheet (7Mb)
2.8
When PRI_IDLE mode is selected, the designated
primary oscillator continues to run without interruption.
For all other power-managed modes, the oscillator
using the OSC1 pin is disabled. The OSC1 pin (and
OSC2 pin, if used by the oscillator) will stop oscillating.
In
SEC_IDLE), the Timer1 oscillator is operating and
providing the device clock. The Timer1 oscillator may
also run in all power-managed modes if required to
clock Timer1 or Timer3.
In internal oscillator modes (RC_RUN and RC_IDLE),
the internal oscillator block provides the device clock
source. The 31 kHz INTRC output can be used directly
to provide the clock and may be enabled to support
various special features, regardless of the power-
managed mode (see Section 23.2 “Watchdog Timer
(WDT)”, Section 23.3 “Two-Speed Start-up” and
Section 23.4 “Fail-Safe Clock Monitor” for more
information on WDT, Fail-Safe Clock Monitor and Two-
Speed Start-up). The INTOSC output at 8 MHz may be
used directly to clock the device or may be divided
down by the postscaler. The INTOSC output is disabled
if the clock is provided directly from the INTRC output.
If the Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
have been stopped, Sleep mode achieves the lowest
current consumption of the device (only leakage
currents).
Enabling any on-chip feature that will operate during
Sleep will increase the current consumed during Sleep.
The INTRC is required to support WDT operation. The
Timer1 oscillator may be operating to support a Real-
TABLE 2-3:
© 2008 Microchip Technology Inc.
RC, INTIO1
RCIO
INTIO2
ECIO
EC
LP, XT and HS
Note:
secondary
OSC Mode
Effects of Power-Managed Modes
on the Various Clock Sources
See Table 4-2 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR Reset.
OSC1 AND OSC2 PIN STATES IN SLEEP MODE
clock
modes
Floating, external resistor should pull high
Floating, external resistor should pull high
Configured as PORTA, bit 7
Floating, pulled by external clock
Floating, pulled by external clock
Feedback inverter disabled at quiescent
voltage level
(SEC_RUN
OSC1 Pin
PIC18F2525/2620/4525/4620
and
Time Clock. Other features may be operating that do
not require a device clock source (i.e., MSSP slave,
PSP, INTx pins and others). Peripherals that may add
significant
Section 26.2 “DC Characteristics”.
2.9
Power-up delays are controlled by two timers, so that no
external Reset circuitry is required for most applications.
The delays ensure that the device is kept in Reset until
the device power supply is stable under normal circum-
stances and the primary clock is operating and stable.
For additional information on power-up delays, see
Section 4.5 “Device Reset Timers”.
The first timer is the Power-up Timer (PWRT), which
provides a fixed delay on power-up (parameter 33,
Table 26-10). It is enabled by clearing (= 0) the
PWRTEN Configuration bit.
The second timer is the Oscillator Start-up Timer
(OST), intended to keep the chip in Reset until the
crystal oscillator is stable (LP, XT and HS modes). The
OST does this by counting 1024 oscillator cycles
before allowing the oscillator to clock the device.
When the HSPLL Oscillator mode is selected, the
device is kept in Reset for an additional 2 ms, following
the HS mode OST delay, so the PLL can lock to the
incoming clock frequency.
There is a delay of interval, T
Table 26-10), following POR, while the controller
becomes ready to execute instructions. This delay runs
concurrently with any other delays. This may be the
only delay that occurs when any of the EC, RC or INTIO
modes are used as the primary clock source.
Power-up Delays
At logic low (clock/4 output)
Configured as PORTA, bit 6
Configured as PORTA, bit 6
Configured as PORTA, bit 6
At logic low (clock/4 output)
Feedback inverter disabled at quiescent
voltage level
current
consumption
OSC2 Pin
CSD
DS39626E-page 31
are
(parameter 38,
listed
in
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