PIC18F4523-I/PT Microchip Technology, PIC18F4523-I/PT Datasheet - Page 373

IC PIC MCU FLASH 16KX16 44TQFP

PIC18F4523-I/PT

Manufacturer Part Number
PIC18F4523-I/PT
Description
IC PIC MCU FLASH 16KX16 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4523-I/PT

Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
44-TQFP, 44-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
EUSART/I2C/MSSP/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, 53275-917, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F4523-I/PT
Manufacturer:
LUMILEDS
Quantity:
1 001
Part Number:
PIC18F4523-I/PT
Manufacturer:
Microchip Technology
Quantity:
1 966
Part Number:
PIC18F4523-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F4523-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
PIC18F2423/2523/4423/4523
Dimension Limits
Preliminary
φ
E1
Units
A2
A1
E1
D1
L
L1
N
A
E
D
α
NOTE 2
e
L
φ
c
b
β
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.30
11°
11°
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
Microchip Technology Drawing C04-076B
α
MAX
1.20
0.15
0.75
0.20
0.45
1.05
13°
13°
A2
DS39755B-page 371

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