DSPIC30F5015-30I/PT Microchip Technology, DSPIC30F5015-30I/PT Datasheet - Page 223

• Manufacturer Part Number: DSPIC30F5015-30I/PT
• Description: IC DSPIC MCU/DSP 66K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F5015-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 66KB (22K x 24)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 52
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 52
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 64TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx10-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F501530IPT

APPENDIX A:
Revision A (July 2005)
Original data sheet for dsPIC30F5015/5016 devices.
Revision B (September 2006)
Revision B of this data sheet reflects these changes:
• Base instruction CP1 removed (see
• Supported I
• ADC Conversion Clock selection (see
• Revised Electrical Characteristics
Revision C (January 2007)
This revision includes updates to the packaging
diagram.
© 2011 Microchip Technology Inc.
Section 20.0 “10-bit High-Speed Analog-to-
Digital Converter (ADC)
- Operating current (I
- Idle current (I
- Power-down current (I
- I/O Pin input specifications
- BOR voltage limits
- Watchdog Timer limits
(see
(see
(see
(see
(see
(see
Table
Table
Table
Table
Table
Table
2
C Slave Addresses (see
24-6)
24-7)
24-8)
24-9)
24-11)
24-21)
IDLE
) specifications
REVISION HISTORY
DD
) specifications
PD
Module”)
) specifications
Table
Table
22-2)
17-1)
Revision D (March 2008)
This revision reflects these updates:
• Changed the location of the input reference in the
• Added FUSE Configuration Register (FICD)
• Added Note 2 in Device Configuration Registers
• Removed erroneous statement regarding genera-
• Electrical Specifications:
• Removed dsPIC30F6010 device reference from
• Removed IC5 and IC6 pin references from the
• Changed Interrupt Vectors 40-43 to Reserved
• Updated PMD2 SFR – bits 15-12 and 7-4 are
• Additional minor corrections throughout the
10-bit High-Speed ADC Functional Block Diagram
(see
details (see
Registers”
table
tion of CAN receive errors (see
“Receive
- Resolved TBD values for parameters DO10,
- 10-bit High-Speed ADC t
- Parameter OS65 (Internal RC Accuracy) has
- Parameter DC12 (RAM Data Retention Volt-
- Parameter D134 (Erase/Write Cycle Time)
- Removed parameters OS62 (Internal FRC
- Parameter OS63 (Internal FRC Accuracy)
- Updated Min and Max values and Conditions
the third paragraph of
EEPROM Memory”
64-pin TQFP pin diagram (see
and
(see
unimplemented (see
document
dsPIC30F5015/5016
DO16, DO20, and DO26 (see
ter (time to stabilize) has been updated from
20 µs typical to 20 µs maximum (see
Table
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table
age) Min and Max values have been updated
(see
has been updated to include Min and Max
values and the Typ value has been removed
(see
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table
has been expanded to reflect multiple Min
and Max values for different temperatures
(see
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for parame-
ter SY20 (see
Figure 1-1
Figure
Table
(Table
Table
Table
Table
24-41)
24-19)
24-18)
Errors”)
5-1)
Section 21.6 “Device Configuration
20-1)
and
21-8)
24-5)
24-12)
24-18)
Table
Table
Table
Section 7.0 “Data
21-8)
24-21)
PDU
21-7)
“Pin
timing parame-
Section 19.4.5
Table
DS70149E-page 223
Diagram”)
24-10)