AT91SAM9260B-QU Atmel, AT91SAM9260B-QU Datasheet - Page 183

IC ARM9 MCU 208-PQFP

AT91SAM9260B-QU

Manufacturer Part Number
AT91SAM9260B-QU
Description
IC ARM9 MCU 208-PQFP
Manufacturer
Atmel
Series
AT91SAMr
Datasheets

Specifications of AT91SAM9260B-QU

Core Processor
ARM9
Core Size
16/32-Bit
Speed
180MHz
Connectivity
EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
POR, WDT
Number Of I /o
96
Program Memory Size
32KB (32K x 8)
Program Memory Type
ROM
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-MQFP, 208-PQFP
Package
208PQFP
Device Core
ARM926EJ-S
Family Name
91S
Maximum Speed
180 MHz
Operating Supply Voltage
1.8|3.3 V
Data Bus Width
32 Bit
Number Of Programmable I/os
96
Interface Type
EBI/Ethernet/SPI/TWI/UART/USART/USB
On-chip Adc
4-chx10-bit
Number Of Timers
6
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Ram Size
8 KB
Maximum Clock Frequency
180 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9260-EK
Minimum Operating Temperature
- 40 C
Cpu Family
AT91
Device Core Size
32b
Frequency (max)
180MHz
Total Internal Ram Size
8KB
# I/os (max)
96
Number Of Timers - General Purpose
6
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
1.95/3.6V
Operating Supply Voltage (min)
1.65/3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
208
Package Type
PQFP
For Use With
AT91SAM9260-EK - KIT EVAL FOR AT91SAM9260AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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20.10.2
Figure 20-22. TDF Optimization: No TDF wait states are inserted if the TDF period is over when the next access begins
20.10.3
6221I–ATARM–17-Jul-09
D[31:0]
A
NCS0
[25:2]
NWE
MCK
NRD
TDF Optimization Enabled (TDF_MODE = 1)
TDF Optimization Disabled (TDF_MODE = 0)
read access on NCS0 (NRD controlled)
When the TDF_MODE of the SMC_MODE register is set to 1 (TDF optimization is enabled), the
SMC takes advantage of the setup period of the next access to optimize the number of wait
states cycle to insert.
Figure 20-22
NWE, on Chip Select 0. Chip Select 0 has been programmed with:
NRD_HOLD = 4; READ_MODE = 1 (NRD controlled)
NWE_SETUP = 3; WRITE_MODE = 1 (NWE controlled)
TDF_CYCLES = 6; TDF_MODE = 1 (optimization enabled).
When optimization is disabled, tdf wait states are inserted at the end of the read transfer, so that
the data float period is ended when the second access begins. If the hold period of the read1
controlling signal overlaps the data float period, no additional tdf wait states will be inserted.
Figure
with no TDF optimization.
• read access followed by a read access on another chip select,
• read access followed by a write access on another chip select,
• read access followed by a write access on the same chip select,
20-23,
shows a read access controlled by NRD, followed by a write access controlled by
Figure 20-24
NRD_HOLD= 4
TDF_CYCLES = 6
and
Figure 20-25
Read to Write
Wait State
illustrate the cases:
NWE_SETUP= 3
write access on NCS0 (NWE controlled)
AT91SAM9260
183

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