P80C32X2FN,112 NXP Semiconductors, P80C32X2FN,112 Datasheet - Page 4

• Manufacturer Part Number: P80C32X2FN,112
• Description: IC 80C51 MCU 256 ROMLESS 40DIP
• Manufacturer: NXP Semiconductors
• Series: 80Cr

Specifications of P80C32X2FN,112

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR
• Number Of I /o: 32
• Program Memory Type: ROMless
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Cpu Family: 80C
• Device Core: 80C51
• Device Core Size: 8b
• Frequency (max): 33MHz
• Interface Type: UART
• Program Memory Size: Not Required
• Total Internal Ram Size: 256Byte
• # I/os (max): 32
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 40
• Package Type: PDIP
• Processor Series: P80C3x
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 935269611112; P80C32X2FN; P80C32X2FN

Philips Semiconductors
P80C31/32X2 ORDERING INFORMATION (ROMLESS)
P87C51X2 ORDERING INFORMATION (4 KBYTE OTP)
P87C52X2 ORDERING INFORMATION (8 KBYTE OTP)
P87C54X2 ORDERING INFORMATION (16 KBYTE OTP)
P87C58X2 ORDERING INFORMATION (32 KBYTE OTP)
All OTP parts listed here are also available as ROM parts (80C5xX2). Please contact your Philips representative if you would like to order a
ROM part.
2003 Jan 24
Type number
P80C31X2BA
P80C31X2BN
P80C32X2BA
P80C32X2BN
P80C32X2BBD
P80C32X2FA
P80C32X2FN
Type number
P87C51X2BA
P87C51X2BN
P87C51X2BBD
P87C51X2FA
P87C51X2FBD
Type number
P87C52X2BA
P87C52X2BN
P87C52X2BBD
P87C52X2FA
P87C52X2FN
P87C52X2FBD
Type number
P87C54X2BA
P87C54X2BN
P87C54X2BBD
P87C54X2BDH
P87C54X2FA
P87C54X2FBD
Type number
P87C58X2BA
P87C58X2BN
P87C58X2BBD
P87C58X2FA
P87C58X2FBD
P87C58X2FN
80C51 8-bit microcontroller family
4K/8K/16K/32K ROM/OTP, low voltage (2.7 to 5.5 V),
low power, high speed (30/33 MHz)
Package
Name
PLCC44
DIP40
PLCC44
DIP40
LQFP44
PLCC44
DIP40
Package
Name
PLCC44
DIP40
LQFP44
PLCC44
LQFP44
Package
Name
PLCC44
DIP40
LQFP44
PLCC44
DIP40
LQFP44
Package
Name
PLCC44
DIP40
LQFP44
TSSOP38
PLCC44
LQFP44
Package
Name
PLCC44
DIP40
LQFP44
PLCC44
LQFP44
DIP40
Description
plastic leaded chip carrier; 44 leads
plastic dual in-line package; 40 leads (600 mil)
plastic leaded chip carrier; 44 leads
plastic dual in-line package; 40 leads (600 mil)
plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
plastic leaded chip carrier; 44 leads
plastic dual in-line package; 40 leads (600 mil)
Description
plastic leaded chip carrier; 44 leads
plastic dual in-line package; 40 leads (600 mil)
plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
plastic leaded chip carrier; 44 leads
plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
Description
plastic leaded chip carrier; 44 leads
plastic dual in-line package; 40 leads (600 mil)
plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
plastic leaded chip carrier; 44 leads
plastic dual in-line package; 40 leads (600 mil)
plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
Description
plastic lead chip carrier; 44 leads
plastic dual in-line package; 40 leads (600 mil)
plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
plastic thin shrink small outline package; 38 leads; body width 4.4 mm;
lead pitch 0.5 mm
plastic lead chip carrier; 44 leads
plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
Description
plastic lead chip carrier; 44 leads
plastic dual in-line package; 40 leads (600 mil)
plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
plastic lead chip carrier; 44 leads
plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm
plastic dual in-line package; 40 leads (600 mil)
4
P80C3xX2; P80C5xX2;
Version
SOT187-2
SOT129-1
SOT187-2
SOT129-1
SOT389-1
SOT187-2
SOT129-1
Version
SOT187-2
SOT129-1
SOT389-1
SOT187-2
SOT389-1
Version
SOT187-2
SOT129-1
SOT389-1
SOT187-2
SOT129-1
SOT389-1
Version
SOT187-2
SOT129-1
SOT389-1
SOT510-1
SOT187-2
SOT389-1
Version
SOT187-2
SOT129-1
SOT389-1
SOT187-2
SOT389-1
SOT129-1
P87C5xX2
Temperature
R
Range ( C)
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
–40 to +85
–40 to +85
Temperature
R
Range ( C)
0 to +70
0 to +70
0 to +70
–40 to +85
–40 to +85
Temperature
R
Range ( C)
0 to +70
0 to +70
0 to +70
–40 to +85
–40 to +85
–40 to +85
Temperature
R
Range ( C)
0 to +70
0 to +70
0 to +70
0 to +70
–40 to +85
–40 to +85
Temperature
R
Range ( C)
0 to +70
0 to +70
0 to +70
–40 to +85
–40 to +85
–40 to +85
Product data
( C)
( C)
( C)
( C)
( C)