LPC2290FBD144/01,5 NXP Semiconductors, LPC2290FBD144/01,5 Datasheet
LPC2290FBD144/01,5
Specifications of LPC2290FBD144/01,5
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LPC2290FBD144/01-S
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LPC2290FBD144/01,5 Summary of contents
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LPC2290 16/32-bit ARM microcontroller with CAN, 10-bit ADC and external memory interface Rev. 03 — 16 November 2006 1. General description The LPC2290 microcontroller is based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support. For critical ...
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... NXP Semiconductors I Eight channel 10-bit ADC with conversion time as low as 2. Two 32-bit timers (with four capture and four compare channels), PWM unit (six outputs), Real-Time Clock (RTC) and watchdog. I Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses. ...
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... NXP Semiconductors 4. Block diagram LPC2290 LPC2290/01 P0[31:0] FAST GENERAL (3) PURPOSE I/O P1[31:16], P1[1:0] ARM7 local INTERNAL CONTROLLER EXTERNAL EINT3 to EINT0 INTERRUPTS 4 CAP0 CAPTURE/ 4 CAP1 COMPARE 4 MAT0 TIMER 0/TIMER 1 4 MAT1 AIN3 to AIN0 A/D CONVERTER AIN7 to AIN4 P0[30:0] P1[31:16], P1[1:0] PURPOSE I/O ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 2. LQFP144 pinning LPC2290_3 Product data sheet 16/32-bit ARM microcontroller with external memory interface 1 108 LPC2290 36 73 002aaa797 Rev. 03 — 16 November 2006 LPC2290 © NXP B.V. 2006. All rights reserved ...
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... NXP Semiconductors 5.2 Pin description Table 3. Pin description Symbol Pin P0.0 to P0.31 [1] P0.0/TXD0/ 42 PWM1 [2] P0.1/RXD0/ 49 PWM3/EINT0 [3] P0.2/SCL/ 50 CAP0.0 [3] P0.3/SDA/ 58 MAT0.0/EINT1 [1] P0.4/SCK0/ 59 CAP0.1 [1] P0.5/MISO0/ 61 MAT0.1 [1] P0.6/MOSI0/ 68 CAP0.2 [2] P0.7/SSEL0/ 69 PWM2/EINT2 [1] P0.8/TXD1/ 75 PWM4 LPC2290_3 Product data sheet 16/32-bit ARM microcontroller with external memory interface ...
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... NXP Semiconductors Table 3. Pin description …continued Symbol Pin [2] P0.9/RXD1/ 76 PWM6/EINT3 [1] P0.10/RTS1/ 78 CAP1.0 [1] P0.11/CTS1/ 83 CAP1.1 [1] P0.12/DSR1/ 84 MAT1.0 [1] P0.13/DTR1/ 85 MAT1.1 [2] P0.14/DCD1/ 92 EINT1 [2] P0.15/RI1/ 99 EINT2 [2] P0.16/EINT0/ 100 MAT0.2/CAP0.2 [1] P0.17/CAP1.2/ 101 SCK1/MAT1.2 [1] P0.18/CAP1.3/ 121 MISO1/MAT1.3 LPC2290_3 Product data sheet 16/32-bit ARM microcontroller with external memory interface ...
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... NXP Semiconductors Table 3. Pin description …continued Symbol Pin [1] P0.19/MAT1.2/ 122 MOSI1/CAP1.2 [2] P0.20/MAT1.3/ 123 SSEL1/EINT3 [1] P0.21/PWM5/ 4 CAP1.3 [1] P0.22/CAP0.0/ 5 MAT0.0 [1] P0.23/RD2 6 [1] P0.24/TD2 8 [1] P0.25 21 [4] P0.27/AIN0/ 23 CAP0.1/MAT0.1 [4] P0.28/AIN1/ 25 CAP0.2/MAT0.2 [4] P0.29/AIN2/ 32 CAP0.3/MAT0.3 [4] P0.30/AIN3/ 33 EINT3/CAP0.0 P1.0 to P1.31 LPC2290_3 Product data sheet 16/32-bit ARM microcontroller with external memory interface ...
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... NXP Semiconductors Table 3. Pin description …continued Symbol Pin [5] P1.0/CS0 91 [5] P1.1/OE 90 [5] P1.16/ 34 TRACEPKT0 [5] P1.17/ 24 TRACEPKT1 [5] P1.18/ 15 TRACEPKT2 [5] P1.19/ 7 TRACEPKT3 [5] P1.20/ 102 TRACESYNC [5] P1.21/ 95 PIPESTAT0 [5] P1.22/ 86 PIPESTAT1 [5] P1.23/ 82 PIPESTAT2 [5] P1.24/ 70 TRACECLK [5] P1.25/EXTIN0 60 [5] P1.26/RTCK 52 [5] P1.27/TDO 144 [5] P1.28/TDI 140 [5] P1.29/TCK 126 [5] P1 ...
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... NXP Semiconductors Table 3. Pin description …continued Symbol Pin [5] P1.31/TRST 43 P2.0 to P2.31 [5] P2.0/D0 98 [5] P2.1/D1 105 [5] P2.2/D2 106 [5] P2.3/D3 108 [5] P2.4/D4 109 [5] P2.5/D5 114 [5] P2.6/D6 115 [5] P2.7/D7 116 [5] P2.8/D8 117 [5] P2.9/D9 118 [5] P2.10/D10 120 [5] P2.11/D11 124 [5] P2.12/D12 125 [5] P2.13/D13 127 [5] P2.14/D14 129 [5] P2 ...
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... NXP Semiconductors Table 3. Pin description …continued Symbol Pin [5] P2.18/D18 133 [5] P2.19/D19 134 [5] P2.20/D20 136 [5] P2.21/D21 137 [5] P2.22/D22 1 [5] P2.23/D23 10 [5] P2.24/D24 11 [5] P2.25/D25 12 [5] P2.26/D26/ 13 BOOT0 [5] P2.27/D27/ 16 BOOT1 [5] P2.28/D28 17 [5] P2.29/D29 18 [2] P2.30/D30/ 19 AIN4 [2] P2.31/D31/ 20 AIN5 P3.0 to P3.31 LPC2290_3 Product data sheet ...
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... NXP Semiconductors Table 3. Pin description …continued Symbol Pin [5] P3.0/A0 89 [5] P3.1/A1 88 [5] P3.2/A2 87 [5] P3.3/A3 81 [5] P3.4/A4 80 [5] P3.5/A5 74 [5] P3.6/A6 73 [5] P3.7/A7 72 [5] P3.8/A8 71 [5] P3.9/A9 66 [5] P3.10/A10 65 [5] P3.11/A11 64 [5] P3.12/A12 63 [5] P3.13/A13 62 [5] P3.14/A14 56 [5] P3.15/A15 55 [5] P3.16/A16 ...
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... NXP Semiconductors Table 3. Pin description …continued Symbol Pin [5] P3.20/A20 45 [5] P3.21/A21 44 [5] P3.22/A22 41 [5] P3.23/A23/ 40 XCLK [5] P3.24/CS3 36 [5] P3.25/CS2 35 [5] P3.26/CS1 30 [5] P3.27/WE 29 [2] P3.28/BLS3/ 28 AIN7 [4] P3.29/BLS2/ 27 AIN6 [4] P3.30/BLS1 97 [4] P3.31/BLS0 96 [5] TD1 22 [6] RESET 135 [7] XTAL1 142 [7] XTAL2 141 26, 38, ...
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... NXP Semiconductors Table 3. Pin description …continued Symbol Pin V 138 SSA(PLL) V 37, 110 DD(1V8) V 143 DDA(1V8 31, 39, 51, DD(3V3) 57, 77, 94, 104, 112, 119 V 14 DDA(3V3) [ tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. [ tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input function, this pad utilizes built-in glitch fi ...
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... NXP Semiconductors 6. Functional description 6.1 Architectural overview The ARM7TDMI general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on RISC principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed CISC. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core ...
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... NXP Semiconductors Fig 3. LPC2290 and LPC2290/01 memory map 6.4 Interrupt controller The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and categorizes them as Fast Interrupt Request (FIQ), vectored Interrupt Request (IRQ), and non-vectored IRQ as defined by programmable settings. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted ...
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... NXP Semiconductors Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned to this category. Any of the interrupt requests can be assigned to any of the 16 vectored IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest. Non-vectored IRQs have the lowest priority. ...
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... NXP Semiconductors Table 4. Block SPI1/SSP PLL RTC System Control A/D CAN 6.5 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated, and prior to any related interrupt(s) being enabled ...
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... NXP Semiconductors • All I/O default to inputs after reset. 6.7.2 Fast I/O features available in LPC2290/01 only • Fast I/O registers are located on the ARM local bus for the fastest possible I/O timing. • All GPIO registers are byte addressable. • Entire port value can be written in one instruction. ...
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... NXP Semiconductors • Register locations conform to 16C550 industry standard. • Receiver FIFO trigger points and 14 B. • Built-in baud rate generator. • Standard modem interface signals included on UART1. 6.10.2 UART features available in LPC2290/01 only • The transmission FIFO control enables implementation of software (XON/XOFF) flow control on both UARTs and hardware (CTS/RTS) fl ...
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... NXP Semiconductors 6.12.1 Features • Compliant with SPI specification. • Synchronous, serial, full duplex, communication. • Combined SPI master and slave. • Maximum data bit rate of one eighth of the input clock rate. 6.13 SSP serial I/O controller (available in LPC2290/01 only) The LPC2290/01 contains one Serial Synchronous Port controller (SSP) ...
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... NXP Semiconductors • Four external outputs per timer corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. 6.14.2 Timer features available in LPC2290/01 only • Timers can count cycles of the externally supplied clock providing external event counting functionality 6 ...
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... NXP Semiconductors 6.17 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2290. The Timer is designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions when specifi ...
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... NXP Semiconductors • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard timer if the PWM mode is not enabled. • A 32-bit Timer/Counter with a programmable 32-bit prescaler. ...
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... NXP Semiconductors The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is safe to begin code execution. When power is applied to the chip, or some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on ...
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... NXP Semiconductors 6.19 Emulation and debugging The LPC2290 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on Port 1. This means that all communication, timer and interface peripherals residing on Port 0 are available during the development and debugging phase as they are when the application is run in the embedded system itself ...
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... NXP Semiconductors 7. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage (1.8 V) DD(1V8) V supply voltage (3.3 V) DD(3V3) V analog supply voltage (3.3 V) DDA(3V3) V analog input voltage IA V input voltage I I supply current DD I ground current ...
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... NXP Semiconductors 8. Static characteristics Table 6. Static characteristics +85 C for industrial applications, unless otherwise specified. amb Symbol Parameter V supply voltage (1.8 V) DD(1V8) V supply voltage (3.3 V) DD(3V3) V analog supply voltage DDA(3V3) (3.3 V) Standard port pins, RESET, RTCK I LOW-level input current IL I HIGH-level input current ...
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... NXP Semiconductors Table 6. Static characteristics +85 C for industrial applications, unless otherwise specified. amb Symbol Parameter 2 I C-bus pins V HIGH-level input voltage IH V LOW-level input voltage IL V hysteresis voltage hys V LOW-level output voltage OL I input leakage current LI Oscillator pins V input voltage on pin ...
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... NXP Semiconductors Table 7. ADC static characteristics +125 C unless otherwise specified. ADC frequency 4.5 MHz. DDA amb Symbol Parameter V analog input voltage IA C analog input ia capacitance E differential linearity D error E integral non-linearity L(adj) E offset error O E gain error G E absolute error ...
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... NXP Semiconductors 1023 1022 1021 1020 1019 1018 7 code out offset error E O (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (E (4) Integral non-linearity (E L(adj) (5) Center of a step of the actual transfer curve. Fig 4. ADC characteristics LPC2290_3 Product data sheet ...
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... NXP Semiconductors 9. Dynamic characteristics Table 8. Dynamic characteristics +125 C; V amb DD(1V8) Symbol Parameter External clock f oscillator frequency osc T clock cycle time cy(clk) t clock HIGH time CHCX t clock LOW time CLCX t clock rise time CLCH t clock fall time CHCL Port pins (except P0.2 and P0.3) ...
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... NXP Semiconductors Table 9. External memory interface dynamic characteristics pF amb Symbol Parameter Common to read and write cycles t XCLK HIGH to address valid CHAV time t XCLK HIGH to CS LOW time CHCSL t XCLK HIGH to CS HIGH CHCSH time t XCLK HIGH to address CHANV invalid time Read cycle parameters ...
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... NXP Semiconductors Table 9. External memory interface dynamic characteristics pF amb Symbol Parameter t BLS HIGH to data invalid BLSHDNV time t XCLK HIGH to data valid CHDV time t XCLK HIGH to WE LOW CHWEL time t XCLK HIGH to BLS LOW CHBLSL time t XCLK HIGH to WE HIGH CHWEH time ...
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... NXP Semiconductors 9.1 Timing XCLK CS addr data t CSLOEL OE Fig 5. External memory read access XCLK CS BLS/WE addr data OE Fig 6. External memory write access LPC2290_3 Product data sheet 16/32-bit ARM microcontroller with external memory interface t CSLAV OELAV t CHOEL t CSLDV t AVCSL t WELWEH t CSLWEL t BLSLBLSH ...
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... NXP Semiconductors V 0 0.2V 0.2V 0.45 V Fig 7. External clock timing 9.2 LPC2290 power consumption measurements 60 I current DD (mA Test conditions: code executed from on-chip RAM; all peripherals are enabled in PCONP register; PCLK = (1) 1.8 V core (typical) (2) 1.65 V core (typical) Fig 8. LPC2290 I measured at different frequencies (CCLK) and temperatures ...
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... NXP Semiconductors 15 I current DD (mA Test conditions: Idle mode entered executing code from on-chip RAM; all peripherals are enabled in PCONP register; CCLK PCLK = . 4 (1) 1.8 V core (typical) (2) 1.65 V core (typical) Fig 9. LPC2290 I idle measured at different frequencies (CCLK) and temperatures DD 500 I current ...
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... NXP Semiconductors 10. Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 1 108 109 pin 1 index 144 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 1.45 0.27 mm 1.6 0.25 0.05 1.35 0.17 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 11. Abbreviations Table 11. Acronym ADC AMBA APB CAN CISC CPU FIFO GPIO PLL PWM RAM RISC SPI SRAM SSP TTL UART LPC2290_3 Product data sheet 16/32-bit ARM microcontroller with external memory interface Abbreviations Description Analog-to-Digital Converter Advanced Microcontroller Bus Architecture ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • New features specific to the LPC2290/01 have been added throughout. ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 15. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 Enhancements introduced with LPC2290/01 device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Key features common for LPC2290 and LPC2290/ Ordering information . . . . . . . . . . . . . . . . . . . . . 2 3.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . 14 6.1 Architectural overview ...