LPC3143FET180,551 NXP Semiconductors, LPC3143FET180,551 Datasheet - Page 22

• Manufacturer Part Number: LPC3143FET180,551
• Description: IC ARM9 MCU USB OTG 180TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3143FET180,551

• Package / Case: 180-TFBGA
• Voltage - Supply (vcc/vdd): 1.1 V ~ 1.3 V
• Operating Temperature: -40°C ~ 85°C
• Speed: 270MHz
• Number Of I /o: 20
• Core Processor: ARM9
• Program Memory Type: External Program Memory
• Ram Size: 192K x 8
• Data Converters: A/D 4x10b
• Oscillator Type: External
• Peripherals: DMA, I²S, LCD, PWM, WDT
• Connectivity: EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
• Core Size: 32-Bit
• Processor Series: LPC31
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 192 KB
• Interface Type: I2C, I2S, SPI, JTAG, UART, USB
• Maximum Clock Frequency: 270 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 1.2 V, 1.8 V, 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details

NXP Semiconductors
LPC3141_3143
Preliminary data sheet
Multiple masters can have access to different slaves at the same time.
Figure 5
AHB masters and slaves are numbered according to their AHB port number.
gives an overview of the multi-layer AHB configuration in the LPC3141/3143.
All information provided in this document is subject to legal disclaimers.
Rev. 0.16 — 27 May 2010
LPC3141/3143
© NXP B.V. 2010. All rights reserved.
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