LPC3143FET180,551 NXP Semiconductors, LPC3143FET180,551 Datasheet - Page 45
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LPC3143FET180,551
Manufacturer Part Number
LPC3143FET180,551
Description
IC ARM9 MCU USB OTG 180TFBGA
Manufacturer
NXP Semiconductors
Series
LPC3000r
Datasheet
1.LPC3143FET180551.pdf
(74 pages)
Specifications of LPC3143FET180,551
Package / Case
180-TFBGA
Voltage - Supply (vcc/vdd)
1.1 V ~ 1.3 V
Operating Temperature
-40°C ~ 85°C
Speed
270MHz
Number Of I /o
20
Core Processor
ARM9
Program Memory Type
External Program Memory
Ram Size
192K x 8
Data Converters
A/D 4x10b
Oscillator Type
External
Peripherals
DMA, I²S, LCD, PWM, WDT
Connectivity
EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
Core Size
32-Bit
Processor Series
LPC31
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
192 KB
Interface Type
I2C, I2S, SPI, JTAG, UART, USB
Maximum Clock Frequency
270 MHz
Number Of Timers
5
Operating Supply Voltage
1.2 V, 1.8 V, 3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC3143FET180,551
Manufacturer:
AD
Quantity:
2 872
Company:
Part Number:
LPC3143FET180,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
Table 14.
LPC3141_3143
Preliminary data sheet
Symbol
Standby power mode
I
P
External SDRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); heavy SDRAM load power;
without dynamic clock scaling
I
P
External SDRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); heavy SDRAM load power;
with dynamic clock scaling
I
P
DD
DD
DD
Parameter
Supply current
Power dissipation
Supply current
Power dissipation
Supply current
Power dissipation
Power consumption
8.1 Power consumption
[1]
[2][3]
Conditions
core; VDDI = 1.2 V
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
VDDE_IOA = 1.8 V
VDDE_IOB = 1.8 V
VDDE_IOC = 3.3 v
ADC10B_VDDA33 = 3.3 V
USB_VDDA33 = 3.3 V
USB_VDDA_DRV = 3.3 V
Total for supply domains SUP1, SUP3, SUP4,
SUP8
core; VDDI = 1.2 V
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
VDDE_IOA = 1.8 V
VDDE_IOB = 1.8 V
VDDE_IOC = 3.3 V
ADC10B_VDDA33 = 3.3 V
USB_VDDA33 = 3.3 V
USB_VDDA_DRV = 3.3 V
Total for supply domains SUP1, SUP3, SUP4,
SUP8
core; VDDI = 1.2 V
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
VDDE_IOA = 1.8 V
VDDE_IOB = 1.8 V
VDDE_IOC = 3.3 V
ADC10B_VDDA33 = 3.3 V
USB_VDDA33 = 3.3 V
USB_VDDA_DRV = 3.3 V
Total for supply domains SUP1, SUP3, SUP4,
SUP8
[2]
All information provided in this document is subject to legal disclaimers.
Rev. 0.16 — 27 May 2010
LPC3141/3143
Min
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Typ
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0.175
0.001
0.0008
0.065
0
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1.75
86
1.61
10.5
5.8
0.52
0.0002
1.66
0.895
144.6
67
1.61
10.5
5.8
0.52
0.0002
1.66
0.895
121.8
© NXP B.V. 2010. All rights reserved.
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