STR912FAW47X6 STMicroelectronics, STR912FAW47X6 Datasheet - Page 45
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STR912FAW47X6
Manufacturer Part Number
STR912FAW47X6
Description
MCU ARM9 2048KB FLASH 128LQFP
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet
1.STEVAL-IFW001V1.pdf
(102 pages)
Specifications of STR912FAW47X6
Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
2MB (2M x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
Processor Series
STR912x
Core
ARM966E-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
96 KB
Interface Type
CAN, I2C, IrDA, SSP, UART, USB
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
80
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
STR9
Device Core
ARM966E-S
Device Core Size
16/32Bit
Frequency (max)
96MHz
Total Internal Ram Size
96KB
# I/os (max)
80
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
2/3.6V
Operating Supply Voltage (min)
1.65/1.77/2.5/2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
128
Package Type
LQFP
For Use With
MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-9039
STR912FAW47X6
STR912FAW47X6
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STR912FAW47X6
Manufacturer:
ST
Quantity:
1 560
Company:
Part Number:
STR912FAW47X6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
STR912FAW47X6T
Manufacturer:
STMicroelectronics
Quantity:
10 000
STR91xFAxxx
5.1
Table 7.
1.
2.
3.
10
11
12
1
2
3
4
5
6
7
8
9
No PHYCLK function on STR910F
No USBCLK function on STR910F
NU (Not Used) on STR910FAW devices. D10 is not connected, C11 must be pulled up by a 1.5 kOhm resistor to VDDQ.
RESET_
X1_CPU
X2_CPU
AVREF
AVDD
VSSQ
JTMS
OUTn
EMI_
WEn
P4.2
P4.6
P7.7
P1.5
A
LFBGA144 ball connections
●
●
●
STR91x LFBGA144 ball connections
PLLVSSQ
JRTCK
VDDQ
JTDO
P7.2
P4.1
P4.3
P4.5
P1.4
P1.2
P1.0
P0.7
B
In
future devices and should NOT be connected to ground or any other signal. There are
total of 9 NC (no connection) balls.
Balls H1 and G4 are assigned as EMI bus write signals (EMI_BWR_WRLn and
EMI_WRHn). These two balls can also be configured by the user as EMI low or high
byte select signals (EMI_LBn and EMI_UBn).
The PLLGND (B8) and PLLVDDQ (C9) balls can be connected to VSSQ and VDDQ.
Table 7
PLLVDDQ
USBDP
RESET_
VSSQ
AVSS
P4.0
P4.4
JTDI
P1.3
P1.1
NC
NC
INn
C
A
A
(2)
balls labelled NC are no connect balls. These NC balls are reserved for
W devices.
W devices.
USBDN
MDIO
JRSTn
VDDQ
VSSQ
VDD
P7.0
P7.1
P4.7
P1.7
MII_
P6.7
NC
D
(3)
(3)
TAMPER_
VDDQ
JTCK
P2.0
P2.1
P5.0
P7.5
P7.6
P6.6
P0.6
VSS
NC
IN
E
Doc ID 13495 Rev 6
VDDQ
VSSQ
P7.3
VSS
VDD
P5.1
P1.6
P0.5
NC
NC
NC
NC
F
EMI_BWR_
(EMI_LBn)
WRLn
VSSQ
VDD
P7.4
P6.2
P6.3
P2.6
P6.5
P6.4
VSS
P5.7
NC
G
EMI_WRHn
(EMI_UBn)
EMI_BAAn
VDDQ
P8.1
P6.0
P5.6
P0.4
P5.5
P0.3
P5.3
VSS
P9.4
H
VDDQ
VSSQ
EMI_
EMI_
P8.2
P6.1
P8.5
P2.5
P9.3
P3.3
P0.2
P5.4
RDn
ALE
J
PHYCLK_
P5.2
WAITn
VDDQ
VSSQ
EMI_
P8.7
P8.3
P2.3
P9.2
P3.0
P9.7
P0.1
P3.7
K
(1)
Pin description
USBCLK_
P2.7
VSSQ
VDDQ
VSSQ
P8.0
P8.4
P2.4
VDD
P9.5
P3.4
P3.5
P0.0
L
(2)
45/102
VBATT
BCLK
EMI_
P2.2
P8.6
RTC
RTC
P9.0
P9.1
P9.6
P3.1
P3.2
P3.6
X2_
X1_
M