S9S08SG4E2MTG Freescale Semiconductor, S9S08SG4E2MTG Datasheet - Page 17
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S9S08SG4E2MTG
Manufacturer Part Number
S9S08SG4E2MTG
Description
MCU 4K FLASH 16-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.S9S08SG4E2CSC.pdf
(316 pages)
Specifications of S9S08SG4E2MTG
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
16-TSSOP
Processor Series
S08SG
Core
HCS08
Data Bus Width
8 bit
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Section Number
17.3 On-Chip Debug System (DBG) ....................................................................................................273
17.4 Register Definition ........................................................................................................................277
A.1 Introduction ...................................................................................................................................285
A.2 Parameter Classification ................................................................................................................285
A.3 Absolute Maximum Ratings ..........................................................................................................285
A.4 Thermal Characteristics .................................................................................................................287
A.5 ESD Protection and Latch-Up Immunity ......................................................................................289
A.6 DC Characteristics .........................................................................................................................290
A.7 Supply Current Characteristics ......................................................................................................294
A.8 External Oscillator (XOSC) Characteristics .................................................................................297
A.9 Internal Clock Source (ICS) Characteristics .................................................................................299
A.10 Analog Comparator (ACMP) Electricals ......................................................................................301
A.11 ADC Characteristics ......................................................................................................................302
A.12 AC Characteristics .........................................................................................................................305
A.13 FLASH Specifications ...................................................................................................................311
A.14 EMC Performance .........................................................................................................................312
B.1 Ordering Information ....................................................................................................................313
B.2 Package Information and Mechanical Drawings ..........................................................................313
Freescale Semiconductor
17.2.4 BDC Hardware Breakpoint .............................................................................................272
17.3.1 Comparators A and B ......................................................................................................273
17.3.2 Bus Capture Information and FIFO Operation ...............................................................273
17.3.3 Change-of-Flow Information ..........................................................................................274
17.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................274
17.3.5 Trigger Modes .................................................................................................................275
17.3.6 Hardware Breakpoints ....................................................................................................277
17.4.1 BDC Registers and Control Bits .....................................................................................277
17.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................279
17.4.3 DBG Registers and Control Bits .....................................................................................280
A.12.1 Control Timing ...............................................................................................................305
A.12.2 TPM/MTIM Module Timing ..........................................................................................307
A.12.3 SPI ...................................................................................................................................308
A.14.1 Radiated Emissions .........................................................................................................312
B.1.1 Device Numbering Scheme ............................................................................................313
Ordering Information and Mechanical Drawings
MC9S08SG8 MCU Series Data Sheet, Rev. 6
Electrical Characteristics
Appendix A
Appendix B
Title
Page
17
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