S9S08SG4E2MTG Freescale Semiconductor, S9S08SG4E2MTG Datasheet - Page 288
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S9S08SG4E2MTG
Manufacturer Part Number
S9S08SG4E2MTG
Description
MCU 4K FLASH 16-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.S9S08SG4E2CSC.pdf
(316 pages)
Specifications of S9S08SG4E2MTG
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
16-TSSOP
Processor Series
S08SG
Core
HCS08
Data Bus Width
8 bit
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Appendix A Electrical Characteristics
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P
solving
288
D
(at equilibrium) for a known T
I/O
T
θ
P
P
P
JA
D
int
I/O
A
is neglected) is:
Equation A-1
= P
Equation A-1
= Ambient temperature, °C
= I
= Package thermal resistance, junction-to-ambient, °C/W
= Power dissipation on input and output pins — user determined
int
DD
+ P
× V
I/O
DD
, Watts — chip internal power
and
and
I/O
Equation A-2
Equation A-2
<< P
K = P
int
MC9S08SG8 MCU Series Data Sheet, Rev. 6
A
and can be neglected. An approximate relationship between P
. Using this value of K, the values of P
D
P
× (T
D
T
J
iteratively for any value of T
= K ÷ (T
for K gives:
J
= T
A
) in °C can be obtained from:
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
JA
JA
)
× (P
D
)
2
A
.
D
and T
J
can be obtained by
Freescale Semiconductor
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
and T
J
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