MC9S08AC48MFDE Freescale Semiconductor, MC9S08AC48MFDE Datasheet - Page 317

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MC9S08AC48MFDE

Manufacturer Part Number
MC9S08AC48MFDE
Description
MCU 8BIT 48K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08AC48MFDE

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
38
Program Memory Size
48KB (48K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-QFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
1
2
3
A.9
Freescale Semiconductor
Input leakage error
Pad leakage
Typical values assume V
only and are not tested in production.
1 LSB = (V
Based on input pad leakage current. Refer to pad electricals.
1
2
Load capacitors
Feedback resistor
Series resistor
Typical values are based on characterization data at V
See crystal or resonator manufacturer’s recommendation.
Low range (32k to 100 kHz)
High range (1M – 16 MHz)
Low range
High range
Characteristic
Table A-10. ICG DC Electrical Specifications (Temperature Range = –40 to 125°C Ambient)
Low Gain (HGO = 0)
High Gain (HGO = 1)
Low Gain (HGO = 0)
High Gain (HGO = 1)
Internal Clock Generation Module Characteristics
REFH
3
* R
≥ 8 MHz
4 MHz
1 MHz
AS
Table A-9. 5 Volt 10-bit ADC Characteristics (V
– V
REFL
)/2
DDAD
Characteristic
N
= 5.0V, Temp = 25C, f
10-bit mode
8-bit mode
C
1
EXTAL
MC9S08AC60 Series Data Sheet, Rev. 2
Conditions
Crystal or Resonator
ADCK
=1.0 MHz unless otherwise stated. Typical values are for reference
DD
ICG
R
F
= 5.0V, 25°C or is typical recommended value.
Appendix A Electrical Characteristics and Timing Specifications
Symbol
C
D
R
C
C
R
REFH
S
1
2
F
Symb
XTAL
E
= V
IL
R
DDAD
S
Min
C
2
, V
Min
REFL
Typ
100
See Note
10
10
20
1
0
0
0
= V
1
Typ
±0.2
±0.1
SSAD
1
2
Max
)
Max
±2.5
±1
Unit
LSB
Unit
317
2

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