MCHC908GR8ACFAE Freescale Semiconductor, MCHC908GR8ACFAE Datasheet - Page 261

IC MCU 8K FLASH 8MHZ 32-LQFP

MCHC908GR8ACFAE

Manufacturer Part Number
MCHC908GR8ACFAE
Description
IC MCU 8K FLASH 8MHZ 32-LQFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheets

Specifications of MCHC908GR8ACFAE

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
LVD, POR, PWM
Number Of I /o
21
Program Memory Size
7.5KB (7.5K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Controller Family/series
HC08
No. Of I/o's
21
Ram Memory Size
384Byte
Cpu Speed
8MHz
No. Of Timers
2
Embedded Interface Type
I2C, SCI, SPI
Rohs Compliant
Yes
Processor Series
HC08G
Core
HC08
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8.2 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
FSICEBASE, DEMO908GZ60E, M68CBL05CE, M68EML08GPGTE
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 6 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCHC908GR8ACFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
20.10 Internal Oscillator Characteristics
20.11 External Oscillator Characteristics
Freescale Semiconductor
Internal oscillator base frequency
Internal oscillator tolerance
Internal oscillator multiplier
External clock option
External crystal options
Crystal load capacitance
Crystal fixed capacitance
Crystal tuning capacitance
Feedback bias resistor
Series resistor
1. V
2. Internal oscillator is selectable through software for a maximum frequency. Actual frequency will be
3. f
4. Multiplier must be chosen to limit the maximum bus frequency of 4 MHz for 2.7-V operation and 8 MHz
10. Not required for high-frequency crystals
1. V
2. Setting EXTCLKEN configuration option enables OSC1 pin for external clock square-wave input.
3. No more than 10% duty cycle deviation from 50%
4. EXTSLOW configuration option configures external oscillator for a slow speed crystal and sets the clock monitor circuits of
5. Some modules may require a minimum frequency greater than dc for proper operation. See appropriate table for this
6. MCU speed derates from 32 MHz at V
7. Setting EXTCLKEN and EXTXTALEN configuration options enables OSC1 and OSC2 pins for external crystal option.
8. f
9. Consult crystal vendor data sheet, see
With ICG clock disabled
With ICG clock enabled
EXTSLOW = 1
EXTSLOW = 0
multiplier (N) x base frequency.
for 4.5-V operation.
Bus
EXTSLOW = 1
EXTSLOW = 0
the ICG module to expect an external clock frequency that is higher/lower than the internal oscillator base frequency,
f
information.
DD
Bus
INTOSC.
DD
= (f
= 5.5 Vdc to 2.7 Vdc, V
= (f
= 5.5 to 2.7 Vdc, V
INTOSC
EXTOSC
(9)(10)
(4)
(4)
/ 4) x N when internal clock source selected
(4)
(4)
Characteristic
Characteristic
/ 4) when external clock source is selected.
(2)(3)
MC68HC908GT16 • MC68HC908GT8 • MC68HC08GT16 Data Sheet, Rev. 5.0
(9)
(7)(8)
(9)
(9)
(9)
(4)
SS
= 0 Vdc, T
SS
(2), (3)
= 0 Vdc, T
(1)
(1)
A
DD
= T
Figure 7-4. External Clock Generator Block
A
= 4.5 Vdc to 16 MHz at V
A
= T
(min) to T
A
(min) to T
A
(max), unless otherwise noted
A
f
Symbol
Symbol
f
f
OSC_TOL
f
(max), unless otherwise noted
EXTOSC
EXTOSC
INTOSC
C
C
C
R
R
N
L
1
2
B
S
DD
= 2.7 Vdc.
307.2 k
230.4
dc
30 k
Min
Min
–25
1 M
60
1
(5)
Diagram.
Internal Oscillator Characteristics
2 x C
2 x C
307.2
Typ
Typ
10
L
L
32 M
307.2 k
32 M
100 k
10 M
Max
Max
384
+25
127
(6)
(6)
Unit
Unit
kHz
Hz
Hz
pF
pF
pF
%
261

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