MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 290
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MC9S12XET256MAL
Manufacturer Part Number
MC9S12XET256MAL
Description
MCU 16BIT 256K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12XEP768CAL.pdf
(1328 pages)
Specifications of MC9S12XET256MAL
Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 12x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Cpu Family
HCS12X
Device Core Size
16b
Frequency (max)
50MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
16KB
# I/os (max)
91
Number Of Timers - General Purpose
25
Operating Supply Voltage (typ)
1.8/2.8/5V
Operating Supply Voltage (max)
1.98/2.9/5.5V
Operating Supply Voltage (min)
1.72/2.7/3.13V
On-chip Adc
16-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
16KB
Cpu Speed
50MHz
No. Of Timers
3
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XET256MAL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XET256MAL
Manufacturer:
FREESCALE
Quantity:
20 000
- Current page: 290 of 1328
- Download datasheet (9Mb)
Chapter 7 Background Debug Module (S12XBDMV2)
7.4.1
If the user resets into special single chip mode with the system secured, a secured mode BDM firmware
lookup table is brought into the map overlapping a portion of the standard BDM firmware lookup table.
The secure BDM firmware verifies that the on-chip non-volatile memory (e.g. EEPROM and Flash
EEPROM) is erased. This being the case, the UNSEC and ENBDM bit will get set. The BDM program
jumps to the start of the standard BDM firmware and the secured mode BDM firmware is turned off and
all BDM commands are allowed. If the non-volatile memory does not verify as erased, the BDM firmware
sets the ENBDM bit, without asserting UNSEC, and the firmware enters a loop. This causes the BDM
hardware commands to become enabled, but does not enable the firmware commands. This allows the
BDM hardware to be used to erase the non-volatile memory.
BDM operation is not possible in any other mode than special single chip mode when the device is secured.
The device can be unsecured via BDM serial interface in special single chip mode only. For more
information regarding security, please see the S12X_9SEC Block Guide.
7.4.2
The system must be in active BDM to execute standard BDM firmware commands. BDM can be activated
only after being enabled. BDM is enabled by setting the ENBDM bit in the BDM status (BDMSTS)
register. The ENBDM bit is set by writing to the BDM status (BDMSTS) register, via the single-wire
interface, using a hardware command such as WRITE_BD_BYTE.
After being enabled, BDM is activated by one of the following
When BDM is activated, the CPU finishes executing the current instruction and then begins executing the
firmware in the standard BDM firmware lookup table. When BDM is activated by a breakpoint, the type
of breakpoint used determines if BDM becomes active before or after execution of the next instruction.
In active BDM, the BDM registers and standard BDM firmware lookup table are mapped to addresses
0x7FFF00 to 0x7FFFFF. BDM registers are mapped to addresses 0x7FFF00 to 0x7FFF0B. The BDM uses
these registers which are readable anytime by the BDM. However, these registers are not readable by user
programs.
1. BDM is enabled and active immediately out of special single-chip reset.
2. This method is provided by the S12X_DBG module.
290
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
•
•
•
•
Hardware BACKGROUND command
CPU BGND instruction
External instruction tagging mechanism
Breakpoint force or tag mechanism
Security
Enabling and Activating BDM
If an attempt is made to activate BDM before being enabled, the CPU
resumes normal instruction execution after a brief delay. If BDM is not
enabled, any hardware BACKGROUND commands issued are ignored by
the BDM and the CPU is not delayed.
MC9S12XE-Family Reference Manual , Rev. 1.23
2
2
NOTE
1
:
Freescale Semiconductor
Related parts for MC9S12XET256MAL
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![MC14560BCP](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC12034AP](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MPIC2112P](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC14520BCP](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC12026AP](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC145152P2](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC68HC11A0P](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MCM6726DWJ10](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC44355](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC13282AP](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC14519BCP](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC14495P1](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![SN74LS796N](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC142100CP](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
![MC34014P](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_tmb.jpg)
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet: