MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 639

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MC9S12XET256MAL

Manufacturer Part Number
MC9S12XET256MAL
Description
MCU 16BIT 256K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XET256MAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 12x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Cpu Family
HCS12X
Device Core Size
16b
Frequency (max)
50MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
16KB
# I/os (max)
91
Number Of Timers - General Purpose
25
Operating Supply Voltage (typ)
1.8/2.8/5V
Operating Supply Voltage (max)
1.98/2.9/5.5V
Operating Supply Voltage (min)
1.72/2.7/3.13V
On-chip Adc
16-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
16KB
Cpu Speed
50MHz
No. Of Timers
3
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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16.3.3.2
The eight data segment registers, each with bits DB[7:0], contain the data to be transmitted or received.
The number of bytes to be transmitted or received is determined by the data length code in the
corresponding DLR register.
Module Base + 0x00X4 to Module Base + 0x00XB
Freescale Semiconductor
Module Base + 0x00X2
Module Base + 0x00X3
DB[7:0]
Field
7-0
Reset:
Reset:
Reset:
W
W
R
R
Figure 16-34. Data Segment Registers (DSR0–DSR7) — Extended Identifier Mapping
W
R
Data bits 7-0
Data Segment Registers (DSR0-7)
7
x
7
x
DB7
7
x
Figure 16-32. Identifier Register 2 — Standard Mapping
Figure 16-33. Identifier Register 3 — Standard Mapping
= Unused; always read ‘x’
= Unused; always read ‘x’
Table 16-33. DSR0–DSR7 Register Field Descriptions
6
x
6
x
DB6
x
6
MC9S12XE-Family Reference Manual Rev. 1.23
5
x
5
x
DB5
5
x
Chapter 16 Freescale’s Scalable Controller Area Network (S12MSCANV3)
4
x
4
x
DB4
Description
4
x
x
x
DB3
3
3
x
3
DB2
2
x
2
x
2
x
DB1
x
x
1
1
1
x
DB0
0
x
0
x
x
0
639

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