HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 115

MCU 3V 256K 144-QFP

HD64F2338VFC25

Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of HD64F2338VFC25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in
Figure 3.2 H8S/2338 Memory Map in Each Operating Mode (cont)
SYSCR to 0.
Mode 14 User Program Mode
H'000000
H'010000
H'040000
H'FFDC00
H'FFFC00
H'FFFE50
H'FFFF08
H'FFFF28
H'FFFFFF
(advanced expanded mode
with on-chip ROM enabled)
External address
External address
External address
external address
On-chip RAM
On-chip ROM/
On-chip ROM
I/O registers
I/O registers
space
Internal
Internal
space
space
space
(F-ZTAT Version Only)
*1
*3
Mode 15 User Program Mode
H'000000
H'010000
H'03FFFF
H'FFDC00
H'FFFBFF
H'FFFE50
H'FFFF07
H'FFFF28
H'FFFFFF
Rev.4.00 Sep. 07, 2007 Page 83 of 1210
(advanced single-chip
mode)
reserved area
On-chip RAM
On-chip ROM
On-chip ROM/
I/O registers
I/O registers
Internal
Internal
*3
*2
REJ09B0245-0400

Related parts for HD64F2338VFC25