HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 822

MCU 3V 256K 144-QFP

HD64F2338VFC25

Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of HD64F2338VFC25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
• PROM mode
19.13.2 Overview
Block Diagram
Rev.4.00 Sep. 07, 2007 Page 790 of 1210
REJ09B0245-0400
Legend:
FLMCR1: Flash memory control register 1
FLMCR2: Flash memory control register 2
EBR1:
EBR2:
RAMER:
SYSCR2: System control register 2
Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as
well as in on-board programming mode.
Erase block register 1
Erase block register 2
RAM emulation register
SYSCR2
FLMCR1
FLMCR2
RAMER
EBR1
EBR2
Figure 19.29 Block Diagram of Flash Memory
Internal data bus (16 bits)
Internal address bus
Bus interface/controller
Flash memory
(256 kbytes)
Operating
mode
FWE pin
Mode pins

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