HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 26

• Manufacturer Part Number: HD64F2338VFC25
• Description: MCU 3V 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2338VFC25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

16.6 Usage Notes ...................................................................................................................... 716
Section 17 D/A Converter
17.1 Overview........................................................................................................................... 721
17.2 Register Descriptions ........................................................................................................ 724
17.3 Operation........................................................................................................................... 727
Section 18 RAM
18.1 Overview........................................................................................................................... 729
18.2 Register Descriptions ........................................................................................................ 730
18.3 Operation........................................................................................................................... 731
18.4 Usage Note........................................................................................................................ 731
Section 19 ROM
19.1 Overview........................................................................................................................... 733
19.2 Register Descriptions ........................................................................................................ 734
19.3 Operation........................................................................................................................... 735
19.4 Overview of Flash Memory (H8S/2339 F-ZTAT)............................................................ 738
Rev.4.00 Sep. 07, 2007 Page xxiv of xxx
17.1.1 Features................................................................................................................ 721
17.1.2 Block Diagram..................................................................................................... 722
17.1.3 Pin Configuration................................................................................................. 723
17.1.4 Register Configuration......................................................................................... 723
17.2.1 D/A Data Registers 0 to 3 (DADR0 to DADR3) ................................................. 724
17.2.2 D/A Control Registers 01 and 23 (DACR01, DACR23) ..................................... 724
17.2.3 Module Stop Control Register (MSTPCR) .......................................................... 726
18.1.1 Block Diagram..................................................................................................... 729
18.1.2 Register Configuration......................................................................................... 730
18.2.1 System Control Register (SYSCR) ...................................................................... 730
19.1.1 Block Diagram..................................................................................................... 733
19.1.2 Register Configuration......................................................................................... 734
19.2.1 Mode Control Register (MDCR) ......................................................................... 734
19.2.2 Bus Control Register L (BCRL) .......................................................................... 735
19.4.1 Features................................................................................................................ 738
19.4.2 Overview.............................................................................................................. 739
19.4.3 Flash Memory Operating Modes ......................................................................... 740
19.4.4 On-Board Programming Modes........................................................................... 741
19.4.5 Flash Memory Emulation in RAM ...................................................................... 743
19.4.6 Differences between Boot Mode and User Program Mode ................................. 744
19.4.7 Block Configuration............................................................................................. 745
19.4.8 Pin Configuration................................................................................................. 746
.................................................................................................................. 729
.................................................................................................................. 733
................................................................................................. 721