D64F3437TFLH16V Renesas Electronics America, D64F3437TFLH16V Datasheet - Page 123
D64F3437TFLH16V
Manufacturer Part Number
D64F3437TFLH16V
Description
MCU 5V 60K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300r
Datasheet
1.HD64F3437STF16V.pdf
(755 pages)
Specifications of D64F3437TFLH16V
Core Processor
H8/300
Core Size
8-Bit
Speed
16MHz
Connectivity
Host Interface, I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
74
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D64F3437TFLH16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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6.2
6.2.1
If an external crystal is connected across the EXTAL and XTAL pins, the on-chip oscillator circuit
generates a system clock signal. Alternatively, an external clock signal can be applied to the
EXTAL pin.
Connecting an External Crystal
Circuit Configuration: An external crystal can be connected as in the example in figure 6.2.
Table 6.1 indicates the appropriate damping resistance Rd. An AT-cut parallel resonance crystal
should be used.
Table 6.1
Frequency (MHz)
Rd max ( )
Crystal Oscillator: Figure 6.3 shows an equivalent circuit of the crystal resonator. The crystal
resonator should have the characteristics listed in table 6.2.
Oscillator Circuit
Oscillator (Generic Device)
Damping Resistance
Figure 6.2 Connection of Crystal Oscillator (Example)
EXTAL
XTAL
2
1 k
Rd
4
500
C
C
L1
L2
8
200
C
L1
10
0
= C
L2
= 10 pF to 22 pF
12
0
16
0
91
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