DF2166VT33 Renesas Electronics America, DF2166VT33 Datasheet - Page 295
DF2166VT33
Manufacturer Part Number
DF2166VT33
Description
MCU FLASH 3V 512K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.HS2168EPI61H-U.pdf
(876 pages)
Specifications of DF2166VT33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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9.3.1
PWSL is used to select the input clock and the PWM data register.
Bit
7
6
5
4
Bit Name
PWCKE
PWCKS
—
—
PWM Register Select (PWSL)
Initial
Value
0
0
1
0
R/W Description
R/W PWM Clock Enable
R
R
PWM Clock Select
These bits, together with bits PWCKB and PWCKA in PCSR,
select the internal clock input to TCNT in the PWM. For
details, see table 9.2.
The resolution, PWM conversion period, and carrier frequency
depend on the selected internal clock, and can be obtained
from the following equations.
Resolution (minimum pulse width) = 1/internal clock frequency
PWM conversion period = resolution × 256
Carrier frequency = 16/PWM conversion period
With a 33 MHz system clock (φ), the resolution, PWM
conversion period, and carrier frequency are as shown in table
9.3.
Reserved
This bit is always read as 1 and cannot be modified.
Reserved
This bit is always read as 0 and cannot be modified.
Rev. 3.00, 03/04, page 253 of 830
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